| Manufacturer Part | 2SD17 |
|---|---|
| Manufacturer | Macchina |
| Description | M2 (UNDER-THE-DASH) OBD2 |
| Category | Development Boards, Kits, Programmers | MCU, FPGA, ADC Evaluation Kits | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 49 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | SAM3X |
| Package: | Retail Package |
| Part Status: | Active |
| Board Type: | Evaluation Platform |
| Type: | MCU 32-Bit |
| Core Processor: | ARM® Cortex®-M3 |
| Operating System: | - |
| Platform: | - |
| Utilized IC / Part: | ATSAM3X |
| Mounting Type: | Fixed |
| Contents: | Board(s) |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
CONN RCP HSG ML 2P INLINE PNL MT
MP CASSETTE, SELF-LAMINATING LAB
M2 (UNDER-THE-DASH) OBD2
BUNDLE EMULATOR/VDSP++
CONN RCPT 4POS CRIMP AND SOLDER
IC TELECOM INTERFACE MULTI LAYER
RF ATTENUATOR 10DB 50OHM 0805
