| Manufacturer Part | SSW-130-02-G-S-RA |
|---|---|
| Manufacturer | Samtec, Inc. |
| Description | CONN RCPT 30POS 0.1 GOLD PCB R/A |
| Category | Connectors & Interconnects Supplier | Ample Chip Electronics Component |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | SSW-130-02-G-S-RA PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 12 - Dec 16 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | SSW |
| Package: | Bulk |
| Part Status: | Active |
| Connector Type: | Receptacle |
| Contact Type: | Forked |
| Style: | Board to Board or Cable |
| Number of Positions: | 30 |
| Number of Positions Loaded: | All |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Rows: | 1 |
| Row Spacing - Mating: | - |
| Mounting Type: | Through Hole, Right Angle |
| Termination: | Solder |
| Fastening Type: | Push-Pull |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Insulation Color: | Black |
| Insulation Height: | 0.095" (2.41mm) |
| Contact Length - Post: | 0.100" (2.54mm) |
| Operating Temperature: | -55°C ~ 125°C |
| Material Flammability Rating: | UL94 V-0 |
| Contact Finish - Post: | Gold |
| Mated Stacking Heights: | - |
| Ingress Protection: | - |
| Features: | - |
| Current Rating (Amps): | 5.7A per Contact |
| Voltage Rating: | - |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
CONN RCPT 30POS 0.1 GOLD PCB R/A
BOARD LEVEL HEAT SINK
BOARD LEVEL HEAT SINK
HEAT SINK
HEATSINK
BOARD LEVEL HEAT SINK
HEAT SINK
