| Manufacturer Part | 0015911641 |
|---|---|
| Manufacturer | Woodhead - Molex |
| Description | CONN HEADER SMD 64POS 2.54MM |
| Category | Connectors & Interconnects Supplier | Ample Chip Electronics Component |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | 0015911641 PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
Not satisfied with the price? Want a lower wholesale price? Please send RFQ, and we will respond immediately
| Type | Description |
|---|---|
| Series: | C-Grid 71308 |
| Package: | Tube |
| Part Status: | Active |
| Connector Type: | Header, Breakaway |
| Contact Type: | Male Pin |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions: | 64 |
| Number of Rows: | 2 |
| Row Spacing - Mating: | 0.100" (2.54mm) |
| Number of Positions Loaded: | All |
| Style: | Board to Board or Cable |
| Shrouding: | Unshrouded |
| Mounting Type: | Surface Mount |
| Termination: | Solder |
| Fastening Type: | Push-Pull |
| Contact Length - Mating: | 0.240" (6.10mm) |
| Contact Length - Post: | - |
| Overall Contact Length: | - |
| Insulation Height: | 0.090" (2.29mm) |
| Contact Shape: | Square |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 150.0µin (3.81µm) |
| Contact Finish - Post: | Tin |
| Contact Material: | Copper Alloy |
| Insulation Material: | Liquid Crystal Polymer (LCP), Glass Filled |
| Features: | Board Guide |
| Operating Temperature: | - |
| Ingress Protection: | - |
| Material Flammability Rating: | UL94 V-0 |
| Insulation Color: | Black |
| Current Rating (Amps): | - |
| Voltage Rating: | - |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
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