| Manufacturer Part | TS391SNL250 |
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Description | THERMALLY STABLE SOLDER PASTE NO |
| Category | Soldering, Desoldering, Rework Products Supplier | Ample Chip Electronics Component |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | TS391SNL250 PDF |
| Availability | 13 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 07 - Dec 11 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 8.8 oz (250g) |
| Shelf Life: | 12 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
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