BDN15-3CB/A01

Manufacturer Part BDN15-3CB/A01
Manufacturer CTS Corporation
Description HEATSINK CPU W/ADHESIVE 1.51"SQ
Category Fans & Thermal Management Supplier | Ample Chip
RoHS Lead free / RoHS Compliant
Warranty 365 days
Datasheet BDN15-3CB/A01 PDF
Availability 0 pieces
Shipped from HK warehouse
Expected Shipping Dec 07 - Dec 11 2025
Quote Request

In Stock Min.: 1 Mult.: 1

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Product Attributes
Type Description
Series:BDN
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Pin Fins
Length:1.510" (38.35mm)
Width:1.510" (38.35mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:4.50°C/W @ 400 LFM
Thermal Resistance @ Natural:15.10°C/W
Material:Aluminum
Material Finish:Black Anodized
More Information
BDN15-3CB/A01
BDN15-3CB/A01
CTS Corporation BDN15-3CB/A01 is available at Ample-Chip.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Documents
Datasheet
BDN15-3CB/A01 PDF
Same Series
BDN15-3CB/A01
BDN15-3CB/A01
HEATSINK CPU W/ADHESIVE 1.51"SQ
CTS Corporation
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BDN12-3CB/A01
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Payment
Payment method Hand Fee
Telegraphic Transfer Request service
Paypal 4% fee
Credit Card 4% fee
Western Union Free of charge
Money Gram Free of charge
Shipping
Shipping Type Lead Time
DHL 2-5 days
Fedex 2-5 days
UPS 2-5 days
TNT 2-6 days
EMS 3-7 days
Registered Air Mail 20-35 days
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