| Manufacturer Part | OMNI-UNI-32-58 |
|---|---|
| Manufacturer | Wakefield-Vette |
| Description | UNIVERSAL TO HEATSINK 32X58MM |
| Category | Fans & Thermal Management Supplier | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | OMNI-UNI-32-58 PDF |
| Availability | 911 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 09 - Dec 13 2025 |
In Stock Min.: 1 Mult.: 1
Not satisfied with the price? Want a lower wholesale price? Please send RFQ, and we will respond immediately
| Type | Description |
|---|---|
| Series: | OmniKlip™ |
| Package: | Tray |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-247, TO-264 |
| Attachment Method: | Clip, Solder Foot |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.250" (31.75mm) |
| Diameter: | - |
| Fin Height: | 1.823" (46.30mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
SLEEVE, 0.5 IN DIA X 2 IN W
RES ARRAY 4 RES MULT OHM 8TSSOP
THERM PAD 8MMX8MM W/ADH 500/PK
UNIVERSAL TO HEATSINK 32X58MM
IC BUFFER NON-INVERT 3.6V 14SO
IC GATE AND 4CH 2-INP 14SO
DGTL ISO 2500VRMS 4CH GP 16SOIC
