Electronic Blog

Chip Technologies and The Race

2890 446 2023-06-19

Semiconductor companies such as TSMC, Samsung, and Intel are pushing the boundaries of chip technology with advanced process nodes, packaging technologies, and innovative designs.

Future Trends of Sensors

3141 430 2023-06-16

The electronica China exhibition will showcase Ample-Chip, a leading electronic component distributor in Asia

TSMC's Efforts to Expand CoWoS Packaging Capacity

2837 335 2023-06-14

TSMC plans to expand the Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging capacity nearly twofold by the end of 2024

Advancements in Integrated Photonics Packaging

1754 507 2023-06-12

The use of advanced packaging technologies and photonic integrated circuits has enabled the development of complex systems on-chip

Semiconductor Industry in China

2532 583 2023-06-03

With the continuous infiltration of the new energy market, the domestic semiconductor industry in China is actively expanding into areas such as automotive production