RF Evaluation and Development Kits, Boards

Image Part Number Description / PDF Quantity Rfq
450-0185

450-0185

Laird Connectivity

EVALUATION KIT SABLE-X-R2 MODULE

29

453-00045-K1

453-00045-K1

Laird Connectivity

DEV KIT STERLING LWB5+ CHIP ANT

17

SDK-AC4486-5A

SDK-AC4486-5A

Laird Connectivity

KIT DESIGN FOR AC4486-5A

0

DVK-BL600-SC

DVK-BL600-SC

Laird Connectivity

BOARD EVAL FOR BL600-SC

2

453-00048-K1

453-00048-K1

Laird Connectivity

DEV KIT STERLING LWB5+ SDIO UART

9

DVK-BTM511-09

DVK-BTM511-09

Laird Connectivity

BLUETOOTH EVAL BOARD BTM511

4

DVK-ST60-2230C

DVK-ST60-2230C

Laird Connectivity

DVK 60 SERIES STERLING MODULE

18

BC600

BC600

Laird Connectivity

BREAKOUT BOARD FOR BL600-SA

10

DVK-RM024-P125-C

DVK-RM024-P125-C

Laird Connectivity

BOARD EVAL FOR RAMP RM024

0

DVK-AC4490LR-1000M

DVK-AC4490LR-1000M

Laird Connectivity

KIT DEVELOPER AC4490LR-1000M

10

DVK-RM186-SM-01

DVK-RM186-SM-01

Laird Connectivity

DEV KIT, INTELLIGENT LORA/BLE EU

1

450-0184

450-0184

Laird Connectivity

EVALUATION KIT SABLE-X-R2 MODULE

7

450-0105

450-0105

Laird Connectivity

BOARD EVAL MODULE TIWI-UB2

2

DVK-BT830-SA-01

DVK-BT830-SA-01

Laird Connectivity

BTV4.0 DUAL MODE DEV KIT

2

455-00023

455-00023

Laird Connectivity

DEV KIT BLUETOOTH 5 PA LNA MHF4

10

DVK-BL600-ST

DVK-BL600-ST

Laird Connectivity

BOARD EVAL FOR BL600-ST

0

BA600

BA600

Laird Connectivity

BREAKOUT BOARD FOR BL600-SA

4

450-0141

450-0141

Laird Connectivity

DEVELOPMENT KIT SABLE-X

1

450-0172

450-0172

Laird Connectivity

STERLING-LWB5 SD CARD DEV BOARD

7

ACC-005

ACC-005

Laird Connectivity

EVAL BOARD CODEC WINBOND W681360

0

RF Evaluation and Development Kits, Boards

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RF Evaluation BoardsFocus on RF signal generation, modulation/demodulation, and impedance matching testing5G base station prototyping, Wi-Fi 6 module testing
RFID Development KitsSupport NFC, UHF/HF RFID tag/reader development with protocol analysisSmart retail payment systems, asset tracking solutions
Multifunctional Development BoardsIntegrate RF, microcontroller, and sensor interfaces for system-level testingIndustrial IoT gateway development, drone communication modules

3. Structure and Components

Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 300 MHz - 6 GHz)Determines application compatibility
Output PowerTransmit power level (e.g., -20 to +20 dBm)Impacts communication distance and FCC compliance
Receiver SensitivityMinimum detectable signal level (e.g., -120 dBm)Affects signal reliability in noisy environments
Impedance MatchingVSWR (Voltage Standing Wave Ratio) 2:1Ensures minimal signal reflection
Power Supply RequirementsVoltage/current specifications (e.g., 3.3V 5%)Critical for system integration

5. Application Areas

  • Telecommunications: 5G NR network testing, satellite communication simulation
  • Healthcare: Wireless patient monitoring device development
  • Retail: NFC-based payment terminal prototyping
  • Industrial: RFID-enabled supply chain automation

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsAFE7444EVMQuad-channel RF-sampling transceiver evaluation
STMicroelectronicsST25RU3993-DISCOUHF RFID reader IC development kit
Nordic SemiconductornRF52840-DKBluetooth 5.2 and Thread protocol testing
Impinj Speedway R420UHF Gen2 RFID reader for logistics automation

7. Selection Guidelines

Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget

8. Industry Trends

Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors

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