| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 48X36" |
0 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 6" X 4" |
21 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 12X12" |
0 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 9" X 6" |
15 |
|
 |
Serpac Electronic Enclosures |
PROTO BRD COPP CLAD 5.26X2.88" |
0 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 6" X 6" |
103 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 6" X 4" |
39 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 6" X 4" |
42 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 9" X 6" |
6 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 5" X 3" |
38 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 6" X 6" |
20 |
|
 |
TubeDepot |
1/8 G10 BOARD BLK |
5 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 9" X 6" |
0 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 12X12" |
2 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 18X12" |
0 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 36X24" |
0 |
|
 |
Pulsar |
PCB BOLARD 4-PACK 6"X8" DOUBLE |
64 |
|
 |
Vector Electronics & Technology, Inc. |
PROTO BOARD COPPER CLAD 12X12" |
0 |
|
 |
Pulsar |
FLEX .005 DBL 2 PNL/PK 8X10 |
22 |
|
 |
MG Chemicals |
PROTO BOARD COPPER CLAD 5" X 3" |
0 |
|
Unperforated prototype boards are blank printed circuit boards (PCBs) without pre-drilled holes, designed for custom circuit prototyping and electronic component assembly. They provide a flexible platform for testing and developing electronic circuits before mass production. These boards are essential in modern electronics development due to their adaptability, cost-effectiveness, and ability to support complex circuit designs.
| Type | Functional Features | Application Examples |
|---|---|---|
| Single-Layer Boards | Single conductive layer on one side | Basic electronic projects, educational purposes |
| Double-Layer Boards | Conductive layers on both sides with via connections | Advanced prototyping, RF circuit design |
| Multi-Layer Boards | Three or more conductive layers with complex interconnections | High-density applications, industrial control systems |
| Flexible Boards | Bendable substrates (e.g., polyimide) | Wearable devices, aerospace applications |
Unperforated prototype boards typically consist of: - Base Substrate: FR-4 glass epoxy or flexible materials - Conductive Layer: Copper foil (1oz-2oz thickness) - Protective Coating: Solder mask (green, blue, or black) - Surface Finish: HASL (Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion Gold)
| Parameter | Typical Value | Importance |
|---|---|---|
| Dimensions | 50mm 50mm to 300mm 300mm | Determines compatibility with target devices |
| Copper Thickness | 18-35 m (0.5-1oz/ft ) | Affects current carrying capacity |
| Dielectric Strength | 500V/ m - 1kV/ m | Ensures electrical insulation safety |
| Thermal Resistance | 130 C - 260 C (depending on material) | Impacts soldering process compatibility |
| Impedance Control | 25 - 120 (for high-frequency designs) | Crucial for signal integrity |
Major industries include: - Consumer Electronics: Smartphone prototypes, IoT devices - Industrial Automation: Sensor arrays, control systems - Telecommunications: RF transceiver modules - Automotive: ECU (Electronic Control Unit) prototypes - Medical Devices: Diagnostic equipment circuit testing
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Elecrow | Crowduino UNO Prototype Shield | Double-layer, 50 50mm, ENIG finish |
| Seeed Studio | PCBWay Custom Prototype | Multi-layer up to 12 layers, 10 m precision |
| Advanced Circuits | ProtoExpress Quick-Turn | Flexible material options, 24-hour turnaround |
Key considerations: - Project complexity (layer count requirements) - Component density (trace width/space capability) - Environmental conditions (temperature/humidity resistance) - Budget constraints (production volume vs prototyping costs) - Regulatory compliance (RoHS, REACH standards)
Current development trends include: - Increased adoption of HDI (High-Density Interconnect) designs - Growth in flexible/rigid-flex board demand (CAGR 8.2% 2023-2030) - Integration with automated prototyping tools (e.g., PCB milling machines) - Advancements in eco-friendly materials (halogen-free substrates) - 3D-printed electronics enabling complex geometries
Application Case: Arduino-based environmental monitoring systems utilize double-layer unperforated boards for sensor array integration, achieving 92% signal integrity at 40MHz operating frequency.