Accessories

Part Number	Description / PDF	Quantity
VI-HAM-CM Vicor	VI-HAM HARMONIC ATTENUATOR MODUL	0
38145 Vicor	AC FRONT END HEATSINK	0
33622 Vicor	HALF PUSH-PIN WH 0.063" 100/BAG	19
VI-AWW-CU Vicor	VI-IAM INPUT ATTENUATOR MODULE	9
43809-09 Vicor	HEAT SINK FOR DCDC CNVTR/ARRAYS	0
40485 Vicor	HS TOP-SIDE 11MM LONGTDNL FLOW	8
URAM3C21 Vicor	URAM OUTPUT ATTENUATION MODULE	25
16493 Vicor	THERMOPAD MAXI	49
APA501-80-006 Emerson Embedded Power (Artesyn Embedded Technologies)	HEATSINK (80) 115X59X37MM HORZ	282
32190 Vicor	HS LOW PROFILE 13.97MM MINI	0
32497 Vicor	DIFFERENTIAL OUTPUT INDUCTOR	30
HUB820-S Vicor	HUB CONNECTOR	119
FLT012A0-SZ GE Critical Power (ABB Embedded Power)	DC INPUT FILTER MODULE	0
01000 Vicor	CAP FILM 4700PF 250VAC RADIAL	593
RSP20-168 RECOM Power	20W 168V CLAMPING SURGE PROTECTO	19
7G0011A TDK-Lambda, Inc.	HEATSINK W/THERM PAD .22"	7
43809-10 Vicor	HEAT SINK FOR DCDC CNVTR/ARRAYS	0
DFN51120 TDK-Lambda, Inc.	RESISTOR THERMAL FUSE - PFE1000	1465
QPI-5LZ Vicor	FILTER 24V 14A ACTIVE EMI	0
30724 Vicor	HEATSINK MINI 0.9" THRU/TRANS	164

Accessories

1. Overview

Board Mount Power Supply Accessories are components designed to facilitate the integration, protection, and optimization of power supply systems on printed circuit boards (PCBs). These accessories ensure reliable electrical connections, thermal management, and electromagnetic compatibility (EMC) in electronic devices. Their importance has grown with advancements in miniaturization, energy efficiency, and high-density computing systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Power Connectors	High-current transmission, polarization protection, vibration resistance	Servers, industrial automation equipment
Heat Sinks	Passive cooling, thermal conduction optimization, airflow compatibility	Power amplifiers, LED lighting systems
Fuse Holders	Overcurrent protection, quick-disconnect design, resettable options	Automotive electronics, consumer appliances
EMI Filters	High-frequency noise suppression, differential/common-mode filtering	Medical imaging equipment, communication infrastructure
Terminal Blocks	Wire-to-board connectivity, screw/clamp termination, color coding	Industrial control panels, HVAC systems

3. Structure and Composition

Typical configurations include:

Power Connectors: Made of phosphor bronze contacts with gold plating, thermoplastic insulation (e.g., LCP), and polarization keys
Heat Sinks: Extruded aluminum fins with matte black anodization, mounting clips or thermal adhesive pads
EMI Filters: Pi-network configuration with X/Y capacitors and common-mode chokes in polymer housing
Fuse Holders: Ceramic body with spring-loaded brass contacts and transparent polycarbonate covers

4. Key Technical Specifications

Parameter	Description	Importance
Current Rating	Maximum continuous operating current (1-50A range)	Determines power capacity and trace sizing
Dielectric Strength	Withstand voltage (500V-5kV AC)	Ensures electrical safety and insulation reliability
Operating Temperature	Functional range (-55 C to +150 C)	Affects performance in harsh environments
Thermal Resistance	C/W rating for heat dissipation efficiency	Directly impacts component lifespan
Insertion Loss	Signal attenuation at specific frequencies (for EMI filters)	Measures noise suppression effectiveness

5. Application Fields

Telecommunications: 5G base stations, optical network units
Consumer Electronics: Gaming consoles, high-end laptops
Medical Devices: MRI scanners, patient monitoring systems
Automotive: EV charging systems, ADAS controllers
Industrial: CNC machines, PLC systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	Power Triple Lock connectors	3-point contact system, 14A rating
CUI Devices	AMM series heat sinks	Multi-finned aluminum design, 20-40 C temperature reduction
Littelfuse	POWR-GARD fuse holders	High-rupture capacity, LED fault indication
Schurter	FMA12 EMI filter	12mm slim profile, 250VAC rating

7. Selection Recommendations

Key considerations:

Electrical parameters matching system requirements (voltage/current derating)
Environmental factors (operating temperature, humidity, vibration)
Compliance with standards (UL/CSA/IEC certifications)
PCB footprint compatibility and assembly method (SMT vs. through-hole)
Total Cost of Ownership (lifetime reliability vs. initial cost)

Example: Selecting a 40A connector with 20% derating for a 32A power rail in an industrial motor drive.

8. Industry Trends

Emerging developments include:

Integration of smart sensors for real-time thermal monitoring
Adoption of advanced materials like graphene-enhanced thermal pads
Miniaturization driven by high-density PCB designs (0.8mm pitch connectors)
Increase in 48V board-level power distribution systems
RoHS-compliant, halogen-free polymer formulations