Static Control Grounding Mats

Part Number	Description / PDF	Quantity
ESDFM-18X36BKT Bertech	18"X36" - ESD FOAM MAT KIT, USA	10
2059USA-18X24GKT Bertech	18"X24" ESD SOLDERING MAT GRAY	50
2059R-2X5BKT Bertech	2'X5' ESD RUBBER MAT KIT, BLUE	0
2059USA-2X6BKT Bertech	2'X6' ESD SOLDERING MAT KIT USA	20
2059USA-18X24BKT Bertech	18"X24" ESD SOLDERING MAT BLUE	50
2059R-3X3BKT Bertech	3'X3' ESD RUBBER MAT KIT, BLUE	0
3059-2.5X4GKT Bertech	2.5'X4' ESD VINYL MAT KIT USA	10
CFM-4X5BLKT Bertech	4'X5'' CONDUCTIVE FLOOR MAT KIT	0
2059S-3X4GNKT Bertech	3'X4' ESD SOLDERING MAT, GREEN	0
2059T-3X3GKT Bertech	3'X3' ESD HIGH TEMPERATURE MAT	50
3059-3X3GKT Bertech	3'X3' ESD VINYL MAT KIT USA GRAY	0
2059T-20X24GKT Bertech	20"X24" ESD HIGH TEMPERATURE MAT	50
2059S-3X3GNKT Bertech	3'X3' ESD SOLDERING MAT, GREEN	0
3059-2.5X50G Bertech	2.5'X50' ESD VINYL MAT USA	0
1059-2X50G Bertech	2'X50' ESD MAT, USA, GRAY	2
2059S-3X4BKT Bertech	3'X4' ESD SOLDERING MAT, BLUE	50
2059T-2X5GNKT Bertech	2'X5' ESD HIGH TEMPERATURE MAT	0
2059T-2X50G Bertech	2'X50' ESD HIGH TEMP. MAT	4
ESDFM-2X4BKT Bertech	2'X4' - ESD FOAM MAT KIT, USA	10
2059S-2.5X50GN Bertech	2.5'X50' ESD SOLDERING MAT,GRN	0

Static Control Grounding Mats

1. Overview

Static Control Grounding Mats are specialized materials designed to prevent electrostatic discharge (ESD) by providing a controlled path to ground. They are critical components in environments where sensitive electronic components, precision manufacturing processes, or contamination-sensitive operations (e.g., cleanrooms) are present. By dissipating static charges safely, these mats protect equipment, ensure product reliability, and comply with international ESD safety standards (e.g., ANSI/ESD S20.20, IEC 61340-5-1).

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Conductive Rubber Mats	Low resistance (10 10 ), rapid charge dissipation	Semiconductor assembly lines, cleanrooms
Anti-Static PVC Mats	Surface resistivity 10 10 , moderate ESD protection	Electronics packaging, light industrial use
Multi-Layer Composite Mats	Hybrid structure with wear-resistant top layer and conductive bottom layer	Aerospace component manufacturing
High-Temperature Resistant Mats	Operational up to 150 C, chemical-resistant coatings	Automotive electronics soldering stations

3. Structure & Composition

A typical grounding mat consists of three layers:

Top Layer: Electrostatic dissipative (ESD) coating (e.g., carbon-infused polymer) for surface charge control.
Conductive Layer: Embedded copper/nickel mesh or conductive rubber for low-resistance grounding.
Base Layer: Dielectric insulating material (e.g., polyvinyl chloride) for environmental isolation.

Connection hardware includes banana jacks (4mm/10mm) and braided ground cords with 1M current-limiting resistors for safety compliance.

4. Key Technical Specifications

Parameter	Typical Range	Importance
Surface Resistivity	10 10	Determines charge dissipation rate
Decay Time	<5 seconds (per MIL-STD-1686)	Measures speed of static neutralization
Wear Resistance	100,000+ cycles (Taber Abraser test)	Longevity in high-traffic areas
Operating Temperature	-20 C to 120 C	Environmental stability
Chemical Resistance	Resists IPA, acetone, mild acids	Compatibility with cleaning agents

5. Application Fields

Semiconductor Manufacturing: Wafer bonding stations, photolithography equipment
Medical Device Assembly: Pacemaker production lines, surgical instrument packaging
Aerospace: Avionics component handling, satellite testing facilities
Pharmaceuticals: Cleanroom environments for sterile drug production
Data Centers: Server maintenance platforms with ESD-sensitive hardware

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
3M	8210+ ESD Mat	Triple-layer design, 10 resistivity, RoHS compliant
Honeywell	FM1000 Conductive Mat	Embedded carbon grid, 5-year durability guarantee
Desco Industries	10350 AlphaMat	Self-healing surface, 10 resistance
Statimat	SM-1200HR	High-temperature resistance up to 150 C

7. Selection Guidelines

Assess ESD sensitivity level of the environment (per IEC 61340-5-1 classification).
Verify compliance with local standards (e.g., UL, CE, NFPA 99).
Consider mechanical stress factors (foot traffic, equipment weight).
Check chemical exposure requirements (cleaning agents, solvents).
Calculate coverage area with 15-20% overlap for grounding continuity.

Case Study

A semiconductor fabrication plant in Taiwan reduced device failure rates by 37% after replacing conventional mats with 3M 8210+ mats, which achieved 95% static charge neutralization within 2 seconds.

8. Industry Trends

Nanomaterial Integration: Graphene-enhanced composites for sub-10 resistivity
Smart Monitoring: Mats with embedded IoT sensors for real-time resistance tracking
Sustainability: Biodegradable PVC alternatives and recyclable conductive polymers
Standardization: Harmonization of MIL-STD, IEC, and ESDA guidelines for global manufacturing

Forecasts indicate 8.2% CAGR in the ESD control market through 2030, driven by EV battery production and 5G infrastructure demands.