Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
25125F

25125F

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLYESTER 6" 135PC

0

SST12P

SST12P

APPLICATOR: PEEK FILL; SS HANDLE

0

900437G

900437G

DUSTER BRUSH; THUND/GOAT; PL HLE

0

23134

23134

SIZE 4 NYLON STRIP BRUSH, 1" HT

0

IT01401/10

IT01401/10

Ideal-tek

1MM HEAD STICKY SWABS 10 PCS

5

0689-00075

0689-00075

SIZE 3/4" CR OX HAIR ART; WD HDL

0

11AL316SS

11AL316SS

HL TOOTHBRUSH; SS FILL; ALUM HDL

0

SST6TEF

SST6TEF

APPLICATOR: PTFE FILL; SS HANDLE

0

900488SD

900488SD

VACUUM BRUSH; SD NYL; SD PL HDLE

0

21N-020W-REDG-12

21N-020W-REDG-12

TOOTHBRUSH; NYL FILL; PLAS HNDLE

0

0907-08000

0907-08000

SZ 8 CR PUR RED SAB RD AR; WD HD

0

403CSC

403CSC

SCRATCH BRUSH; CS FILL; WOOD HDL

0

444CSG

444CSG

SCRATCH BRUSH; CS FILL; WOOD HDL

0

BT606SS

BT606SS

APPLICATOR: SS FILL; BRASS HNDLE

0

LBM-5HH

LBM-5HH

5/8" FLOW-THRU; HH FILL; MALE

0

0907-06000

0907-06000

SZ 6 CR PUR RED SAB RD AR; WD HD

0

FTC-18

FTC-18

18GAUG; FT LUER LOCK; CAMEL FILL

0

6020-07000

6020-07000

SIZE 7 CAMEL RND ARTIST; WD HDLE

0

35697

35697

Tronex (Menda/EasyBraid/Tronex)

BRUSH SINGLE HEAD NYLON 6"

730

DB7

DB7

DOPE BRUSH; HH FILL; WOOD HANDLE

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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