| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY 16 |
9 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY NO-LEAD 16' SMD |
12 |
|
 |
Chip Quik, Inc. |
VACUUM TIP KIT FOR V8910 |
44 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY 4.5' LEAD FREE |
14 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY |
137 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY LF |
9 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY 32 |
9 |
|
 |
Chip Quik, Inc. |
REPLACEMENT CUPS FOR V8910 |
14 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY 8' LEAD FREE |
34 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY 8' LEADED |
14 |
|
 |
Chip Quik, Inc. |
REMOVAL KIT FOR COMPONENTS SMD |
316 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY LF |
9 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY LF |
20 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY 8 F |
19 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY NO-LEAD 32' SMD |
12 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY WIT |
8 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY 4.5' LEADED |
27 |
|
 |
Chip Quik, Inc. |
SMD / SMT CHIP REMOVAL ALLOY LF |
10 |
|
 |
Chip Quik, Inc. |
TOOL VACUUM PICK & PLACE W/TIPS |
85 |
|
 |
Chip Quik, Inc. |
REMOVAL ALLOY 16' SMD |
32 |
|
Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.
| Type | Functional Features | Application Examples |
|---|---|---|
| Soldering Iron Tips | High thermal conductivity, corrosion-resistant coatings, multiple geometries | PCB assembly, fine-pitch component soldering |
| Soldering Stations | Temperature-controlled systems with modular tool integration | Mass production lines, R&D prototyping |
| Desoldering Pumps | Manual/electric vacuum systems for solder removal | Component replacement, PCB repair |
| Hot Air Rework Stations | Precise airflow and temperature control for SMD components | BGA reballing, QFN package replacement |
| Flux Applicators | Controlled application of chemical flux for solderability enhancement | Pre-soldering preparation, rework processes |
Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions
| Parameter | Importance |
|---|---|
| Operating Temperature Range (100-450 C) | Determines material compatibility and process window |
| Temperature Stability ( 2 C) | Critical for solder joint quality and component safety |
| Heating Time (30-90s) | Impacts production efficiency and thermal shock prevention |
| Power Consumption (20-200W) | Affects operating costs and thermal management requirements |
| Tip Lifetime (200-2000h) | Influences maintenance frequency and total ownership cost |
Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)
| Manufacturer | Representative Product |
|---|---|
| Metcal | HX-100 SmartHeat Soldering System |
| Weller | WSD81 Digital Soldering Station |
| JBC | CD-2B Advanced Rework Station |
| Hakko | FR-301 Hot Air Rework Tool |
| Electro-Tech Systems | APS 925HV Selective Soldering System |
Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability
Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)