Accessories

Image Part Number Description / PDF Quantity Rfq
T0058744738N

T0058744738N

Xcelite

HEATING ELEMENT HER 80W/24V

0

T0053632699

T0053632699

Xcelite

VACUUM TUBE DN17 5M

0

100L

100L

Xcelite

TAPE,LONG UNIVERSAL 3/8"X100'

0

T0058735864

T0058735864

Xcelite

PIPE CLAMP 75MM WFE20D

0

6T2

6T2

Xcelite

STOPPER 6CC TAPER TIP MANUAL 500

0

T0058762758

T0058762758

Xcelite

FILTER FOR WFE 2X PRE-FILTER BOX

0

T0058735761

T0058735761

Xcelite

SPACER RUBBER MOUNTS FOR WFE2P 4

0

T0053606099N

T0053606099N

Xcelite

FOOT PEDAL 2-STEP,53606099

0

T0058762750

T0058762750

Xcelite

CONNECTOR 50/60MM FOR WFE

0

T0058761728

T0058761728

Xcelite

ADAPTER NOZZLE AIR HAP1-HAP200

0

T0053634099

T0053634099

Xcelite

FILTER SUBMICRON AIR 53634099

0

WCM1

WCM1

Xcelite

CALIBRATION UNIT FOR EC2002M

0

T0058762764

T0058762764

Xcelite

WFE ADAPTER 60 MM FOR SUCTION AR

0

K191

K191

Xcelite

TIP THERMOCOUPLE WELD NTB

0

T0058751903

T0058751903

Xcelite

LOWER HOUSING WITH BATTERY FOR W

0

T0058735865

T0058735865

Xcelite

DN17 G 3/8" NIPPLE W.THREAD

0

WA2000

WA2000

Xcelite

WELLER SOLDERING IRON ANALYZER

0

T0051394699

T0051394699

Xcelite

WTQB 1000 VACUUM PICK-UP 10MM

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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