Accessories

Image Part Number Description / PDF Quantity Rfq
T0053659199

T0053659199

Xcelite

WFE 2X TABLE HANGING DEVICE

0

T0058755896

T0058755896

Xcelite

REFLOW HOTGAS NOZZLE 90X90 WQB

0

T0051391699

T0051391699

Xcelite

WTQB 1000 PRINT STATION

0

T0053313299

T0053313299

Xcelite

EXCHANGE HANDPIECE

0

XP1500B6

XP1500B6

Xcelite

FRONT PISTON,FOR 1500B

0

T0058762777

T0058762777

Xcelite

WF 60 EXTRACTION ARM 1500MM

0

T0051391799

T0051391799

Xcelite

INTN 1000 DIPP STATION

0

T0058762757

T0058762757

Xcelite

PRE-FILTER BOX WFE 2X

0

T0051391899

T0051391899

Xcelite

WTQB 1000 (MIKRO) SMD POCKET STA

0

T0058768728N

T0058768728N

Xcelite

WSRF 201 FUNNEL F. WSR 201 REPL.

0

T0053632999

T0053632999

Xcelite

PIPE CLAMP 50MM WFE20D

0

T0058762756

T0058762756

Xcelite

EXTRACTION HOSE GRAY 60MM 5 MET

0

T0058762771

T0058762771

Xcelite

WFE ADAPTER 75MM TO 60MM

0

T0058735757

T0058735757

Xcelite

EXHAUST FILTER WFE

0

T0053632399

T0053632399

Xcelite

PIPE STRAIGHT 2MX50MM WFE20D

0

T0051394199

T0051394199

Xcelite

WTQB 1000 VACUUM PICK-UP 0,5MM

0

30T2AB

30T2AB

Xcelite

STOPPER 30CC AIR DRY 1000/PK

0

T0053635299

T0053635299

Xcelite

LOCKING CLIP FOR FUME EXTRACTION

0

T0053659299

T0053659299

Xcelite

WFE 2X ROLLING CART

0

T0058741729

T0058741729

Xcelite

HEAD CSFD 10.0X16.0 58741729

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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