Accessories

Image Part Number Description / PDF Quantity Rfq
T0058735863

T0058735863

Xcelite

REDUCTION DN70/40

0

EC268

EC268

Xcelite

SENSOR ASSEMBLY W/SPRING

0

1L2

1L2

Xcelite

STOPPER 1CC 1000/PK

0

T0058757819

T0058757819

Xcelite

MOUNTING WRENCH CARTRIDGE HAP300

0

T0058735856

T0058735856

Xcelite

REDUCER DN70/40

0

3LL2BDRY

3LL2BDRY

Xcelite

STOPPER 3CC 30000/PK

0

T0051394399

T0051394399

Xcelite

WTQB 1000 VACUUM PICK-UP 5MM

0

T0053634899

T0053634899

Xcelite

EXTRACTION ARM ANTISTAT.

0

T0058735866

T0058735866

Xcelite

NUT G 3/8" (3)

0

C1HE

C1HE

Xcelite

HEATER NEW C1C

0

750-2000-ESDN

750-2000-ESDN

Xcelite

PARTIKELFILTER H13/GASFILTER MG7

0

T0058735871

T0058735871

Xcelite

T-BRANCH PIPE .5MX75MM WFE20D

0

T0058768732N

T0058768732N

Xcelite

WSRH 1 LT TIP MOUNTING PLATE

0

T0051506699

T0051506699

Xcelite

CORD SUPPORT FOR SAFETY REST

0

EC267

EC267

Xcelite

CORD ASSEMBLY FOR EC1201AFE

0

212-5000-ESD

212-5000-ESD

Xcelite

PRE FILTER CASSETTE FT12-PF 3 PI

0

T0058765829

T0058765829

Xcelite

CSF ADAPTER D16.0 XDS

0

T0053634399

T0053634399

Xcelite

CONNECTOR DN17

0

5227K

5227K

Xcelite

TIP CAP PLASTIC 100/PK

0

T0058755999

T0058755999

Xcelite

WQB COVER

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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