Accessories

Image Part Number Description / PDF Quantity Rfq
T0053657899

T0053657899

Xcelite

FUME EXTRACT ARM

0

T0053631699

T0053631699

Xcelite

SUCT HOSE NW44 W/END 53631699

0

T0053633999

T0053633999

Xcelite

AIR FILTER FINE PARTICULATE 10/P

0

T0058751818

T0058751818

Xcelite

FUME EXTRACTION ADAPTER WMRP PEN

0

T0053659599N

T0053659599N

Xcelite

WFE 8S REPLACEMENT COMPACT FILTE

0

T0058768762N

T0058768762N

Xcelite

SILICAN PAD

0

T0051301799N

T0051301799N

Xcelite

SD1000 SOLDER DISPENSER

0

T0058735915

T0058735915

Xcelite

EXHAUST CONNECTOR DN70 WFE 2S

0

8200RH

8200RH

Xcelite

REPLACEMENT HOUSING 8200 SOLDERI

0

T0058735840

T0058735840

Xcelite

EXHAUST CONNECTOR DN100 WFE 4S

0

EC260B

EC260B

Xcelite

REPLACEMENT SENSOR FOR EC1302B

0

HK11

HK11

Xcelite

TIP HOT KNIFE FOR SP23

0

T0053637899

T0053637899

Xcelite

HOOD EXTRACT WFCC50 53637899

0

T0051394599

T0051394599

Xcelite

WTQB 1000 VACUUM PICK-UP 2MM

0

DSH113

DSH113

Xcelite

D-SOLDER TIPLETS DS1204A

0

T0057004800

T0057004800

Xcelite

CORDSET SJT 3XAWG18 USA "B"

0

T0053634199

T0053634199

Xcelite

WIDE BAND GAS FILTER

0

T0051394299

T0051394299

Xcelite

WTQB 1000 VACUUM PICK-UP 3MM

0

212-5001-ESD

212-5001-ESD

Xcelite

MAIN FILTER FT12-PF

0

T0058735920

T0058735920

Xcelite

EXHAUST CONNECTOR DN100 WFE 20D

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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