Accessories

Image Part Number Description / PDF Quantity Rfq
T0053118299

T0053118299

Xcelite

CALIBRATION UNIT FOR WS STATIONS

0

3LL2DRY

3LL2DRY

Xcelite

STOPPER 3CC 1000/PK

0

T0053638099

T0053638099

Xcelite

EXTRACT PLATE WFDD50 5368099

0

T0053118099N

T0053118099N

Xcelite

WCB2 TEMP ANALYZER UNIT 230V

0

1000HA

1000HA

Xcelite

HOSE ASSEMBLY 3FT

0

WES206

WES206

Xcelite

CIRCUIT BOARD FOR WES51(D)

0

KDSDELUXEKIT

KDSDELUXEKIT

Xcelite

DELUXE DISPENSING STARTER KIT

0

SW120

SW120

Xcelite

SWITCH 120V SW120

0

4082

4082

Xcelite

COLLECTION TUBE FOR DSV80

0

TC217

TC217

Xcelite

CORD ASSEMBLY FOR T201T

0

1L2DRY

1L2DRY

Xcelite

STOPPER 1CC DRY 1000/PK

0

AKFE11

AKFE11

Xcelite

AKFE11 ADAPTER KIT FUMEX

0

WES207

WES207

Xcelite

CIRCUIT BOARD FOR WESD51(D)

0

T0058735862N

T0058735862N

Xcelite

PRE FILTER BOX WFE2S

0

KDS805FS

KDS805FS

Xcelite

FINGER SWITCH KDS805FS

0

SCD201

SCD201

Xcelite

DISPOSABLE TUBE REPLACEMENT

0

T0058735833

T0058735833

Xcelite

INTAKE STACK SYST. 75 90 WFE4S

0

T0051360499N

T0051360499N

Xcelite

MINERAL FILTER FOR DS80 PKG/10

0

C8200

C8200

Xcelite

COLLAR FOR 8200 SOLDERING GUN

0

T0058762755

T0058762755

Xcelite

WFE TWIN CONNECTING PLUG 60MM

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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