Accessories

Image Part Number Description / PDF Quantity Rfq
B1303/P

B1303/P

Hakko

DRILL,W/HOLDER,CLEANING,1.0MM,FR

0

B1627

B1627

Hakko

RING,ADJUSTMENT,0.8MM,373

0

B5019

B5019

Hakko

HOLDER,BACK,FR-300

0

B3516

B3516

Hakko

THERMOCOUPLE,FR-870B/872/870/860

0

B1204

B1204

Hakko

FOOT,CHASSIS,4PK,472D/851/928

0

B3401

B3401

Hakko

COVER,DISPLAY,FM-205/204/203

0

B2916

B2916

Hakko

INSULATOR,HEAT,FX-301B/300

0

B1194

B1194

Hakko

COVER,W/O HANDLE,851

0

T0058720746

T0058720746

Xcelite

CABLE FE 25/FE 50/LR 21

0

B3428

B3428

Hakko

MOTOR,FR-400,FM-206/204

0

485-24

485-24

Hakko

AIR HOSE,W/COUPLER,485

0

B1653

B1653

Hakko

ENCLOSURE,NOZZLE,817/807

0

B1069

B1069

Hakko

EJECTOR,VACUUM,FM-205,C1492

0

B1908

B1908

Hakko

WASHER,WAVE WASHER,373

0

B5021

B5021

Hakko

HOUSING,FR-300

0

T0051312099N

T0051312099N

Xcelite

FOOT SWITCH 51312099

0

B1086/P

B1086/P

Hakko

PIN,CLEANING,0.8MM NOZZLE,FR-400

0

B3253

B3253

Hakko

CORD,CONNECTING,FX-801/951,FM-20

0

A1567

A1567

Hakko

BRUSH,CLEANING,B TYPE,METAL,2PK,

0

A1319

A1319

Hakko

PACKING,809/817

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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