Accessories

Image Part Number Description / PDF Quantity Rfq
WPAE

WPAE

Xcelite

EJECTOR FOR PYROPEN WPA2

0

A1586

A1586

Hakko

FILTER,MAIN,FA-430/HJ3100

112

T0051361699

T0051361699

Xcelite

STRAP F/GLASS TUBE PKG/5

0

T0053637399

T0053637399

Xcelite

WFAS 50 EXTRACTION ARM WITH SLOT

0

B1304

B1304

Hakko

CLEANING DRILL

12

T0058765711N

T0058765711N

Xcelite

BARREL TIP RETAINER FOR WXP 120

12

110507EB

110507EB

EMIT

MAIN FILTER - HEPA CHEMICAL

0

T0058741815N

T0058741815N

Xcelite

COLLECTION TUBE FOR DXV80 5/PKG

545

WS102N

WS102N

Xcelite

ASSY BARREL NUT FOR WSP80

93

537S

537S

Xcelite

UNIT HEAT 23W

0

SRS-CAMERA

SRS-CAMERA

EMIT

CAMERA ASSEMBLY, WITH CABLE HARN

0

SMD8NL

SMD8NL

Chip Quik, Inc.

REMOVAL ALLOY 8' LEAD FREE

34

UVO0000000.00

UVO0000000.00

Ideal-tek

ESD VACUUM TOOL. FOR SMD COMP.

0

NZA-SRS-CAL

NZA-SRS-CAL

EMIT

NOZZLE CALIBRATION FOR SCORPION

0

100-2000-ESDN

100-2000-ESDN

Xcelite

H13 REPLACEMENT FILTER FOR MG100

2

300594EB

300594EB

EMIT

BLOWER, 400/400I/400IPVC/800I, 1

0

PR-PCSS

PR-PCSS

Ideal-tek

ROTATION KNOB PCSA

0

M-NT7-22

M-NT7-22

High-Tech Conversions

SPEEDLINE / MPM 20.75 GREEN MONS

0

PCSA-1N

PCSA-1N

Ideal-tek

PRINTED CIRCUIT HOLDER PCSA-1N -

0

MO-BS-PCSS

MO-BS-PCSS

Ideal-tek

SPRING FOR SLIDING RAIL

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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