Accessories

Image Part Number Description / PDF Quantity Rfq
17560

17560

Aven

SOLDER REEL STAND

163

T0058768734N

T0058768734N

Xcelite

SILICON PAD REPLACEMENT FOR WT1/

5

A1572

A1572

Hakko

PRE-FILTER FOR FA-430, 10PK

22

T0058762770N

T0058762770N

Xcelite

KIT1 WF 32 NOZZLE F. WFE S FUME

0

T0058735938

T0058735938

Xcelite

FINE DUST FILTER F7 2S/ZS4V (10)

0

B1087

B1087

Hakko

PIN,CLEANING,1.0MM NOZZLE,N3/802

83

SC-PCSS

SC-PCSS

Ideal-tek

COVER CLIP LEVER PCSA

34

PCSA-1

PCSA-1

Ideal-tek

PCB HOLDER PCSA-1 WITH ESD FOAM

6

XF300

XF300

EDSYN Inc.

PRE-FILTER & FOAM FILTER FOR FX3

5

KDS806

KDS806

Xcelite

FOOT VALVE

9

D550RH

D550RH

Xcelite

REPL HOUSING FOR WELLER D550

0

AS196MK

AS196MK

EDSYN Inc.

MAINTENANCE KIT FOR THE AS196

45

T0054461799N

T0054461799N

Xcelite

FINE POINT CARTRIDGE RT2MS 0.4MM

49

2047

2047

Xcelite

FILTER SECONDARY

0

ALFA

ALFA

Xcelite

BLACK NOZZLE, ESD, 225X100 MM

4

7323W

7323W

Xcelite

SWITCH SINGLE HEAT GUN

0

A1573

A1573

Hakko

MAIN HEPA FILTER FOR FA-430

30

REM32

REM32

Chip Quik, Inc.

SMD / SMT CHIP REMOVAL ALLOY 32

9

V9000K8-B

V9000K8-B

Chip Quik, Inc.

REPLACEMENT CUPS FOR V8910

14

CP01

CP01

Xcelite

CONTACT PYROMETER

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

RFQ BOM Call Skype Email
Top