Accessories

Image Part Number Description / PDF Quantity Rfq
XF01

XF01

EDSYN Inc.

FUMINATOR FILTER SET W/ 1 EA XF0

80

DS017MK

DS017MK

EDSYN Inc.

MAINTENANCE KIT FOR THE DS017

47

B1215

B1215

Hakko

CLEANING PIN, HEATER

43

100039EB

100039EB

EMIT

DUAL MANIFOLD KIT, 50MM - 80MM X

0

100UG

100UG

Xcelite

ADAPTER 1/8 INCH TIP

0

DTP-BGA

DTP-BGA

EMIT

FLUX DIP TRANSFER PLATES BGA

0

17012

17012

Aven

THIRD HAND W/TWEEZERS

102115

202273EB

202273EB

EMIT

PRE-FILTER - LABYRINTH F8/F9 2PK

0

T0058751710N

T0058751710N

Xcelite

TOOL FOR CHANGING NT TIPS

13

EB41D2112

EB41D2112

Tronex (Menda/EasyBraid/Tronex)

UNDER STENCIL WIPE 21"X12"

0

78-07U

78-07U

Master Appliance Corp.

EJECTOR

0

US340MK

US340MK

EDSYN Inc.

MAINTENANCE KIT FOR THE US40

5

17400-4181

17400-4181

Aven

REPLACEMENT HEATER 17400

49

T0053658099

T0053658099

Xcelite

WF 32 EXTRACTION ARM

0

WPAB

WPAB

Xcelite

WPA2 BURNER UNIT (WPA-B)

0

202269EB

202269EB

EMIT

PRE-FILTER - LABYRINTH F6 ALPHA

5

REM32-NL

REM32-NL

Chip Quik, Inc.

SMD / SMT CHIP REMOVAL ALLOY LF

9

AO939+BL

AO939+BL

SRA Soldering Products

VACUUM SUCTION PEN - BLACK

44

T0058770714

T0058770714

Xcelite

ASSY BARREL NUT FOR WEP70

30

W58713799

W58713799

Xcelite

PART CSF RUBBER INSERT 799 10/PK

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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