Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
WTV2S-2P3120

WTV2S-2P3120

SICK

SENSOR PROXIMITY 36MM PNP

0

HL18L-P1G5BA

HL18L-P1G5BA

SICK

SENSOR RETROREFLECTIVE 12M PNP

0

WTB4-3P2261S44

WTB4-3P2261S44

SICK

SENSOR PROXIMITY 150MM PNP

0

HTF18L-P1G5BB

HTF18L-P1G5BB

SICK

SENSOR PROXIMITY 300MM PNP

0

GL10G-P4251

GL10G-P4251

SICK

SENSOR RETROREFLECTIVE 12M PNP

0

HTF18-P1G2BB

HTF18-P1G2BB

SICK

SENSOR PROXIMITY 300MM PNP

0

GSE10-P4111

GSE10-P4111

SICK

SENSOR THROUGH-BEAM 35M PNP

0

WTB2S-2N1151

WTB2S-2N1151

SICK

SENSOR PROXIMITY 150MM NPN

0

ET3-E5228

ET3-E5228

SICK

SENSOR PROXIMITY 10MM NPN DO/LO

0

HTB18-P4C2AB

HTB18-P4C2AB

SICK

SENSOR PROXIMITY 300MM PNP

0

GL6-P7211

GL6-P7211

SICK

SENSOR RETROREFLECTIVE 6MM PNP

0

WTB4S-3P3465V

WTB4S-3P3465V

SICK

SENSOR PROXIMITY 500MM PNP

0

HSE18-N4B2BA

HSE18-N4B2BA

SICK

SENSOR THROUGH-BEAM 25M NPN

0

GSE10-N1212

GSE10-N1212

SICK

SENSOR THROUGH-BEAM 40M NPN

0

GRL18S-F2338

GRL18S-F2338

SICK

SENSOR RETROREFLECTIVE 7.2M PNP

0

WLG4-3F1482S04

WLG4-3F1482S04

SICK

SENSOR RETROREFLECTIVE 1.5M PNP

0

WTS26P-2416H120A71

WTS26P-2416H120A71

SICK

SEN 10-1000MM IO-LINK PUSH/PULL

2

HSE18-P3A2BB

HSE18-P3A2BB

SICK

SENSOR THROUGH-BEAM 25M PNP

0

WTB4S-3N1361

WTB4S-3N1361

SICK

SENSOR PROXIMITY 180MM NPN

0

WTB4S-3P5232H

WTB4S-3P5232H

SICK

SENSOR PROXIMITY 120MM PNP

0

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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