Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA7341LCT

MMA7341LCT

NXP Semiconductors

ACCELEROMETER 3-9G ANALOG 14LGA

0

MMA6811AKW

MMA6811AKW

NXP Semiconductors

ACCELEROMETER 16QFN

0

MMA6811BKCWR2

MMA6811BKCWR2

NXP Semiconductors

ACCELEROMETER 60G/25G SPI 16QFN

0

MMA6825BKWR2

MMA6825BKWR2

NXP Semiconductors

ACCELEROMETER 100G SPI 16QFN

0

MMA2300KEGR2

MMA2300KEGR2

NXP Semiconductors

IC SENSOR ACCELEROMETER 16SOIC

0

MMA2300KEG

MMA2300KEG

NXP Semiconductors

IC SENSOR ACCELEROMETER 16SOIC

0

MMA8205EG

MMA8205EG

NXP Semiconductors

ACCELEROMETER 50G DSI/SPI 16SOIC

0

MMA6331LT

MMA6331LT

NXP Semiconductors

ACCELEROMETER 4-9G ANALOG 14LGA

0

MMA7331LCT

MMA7331LCT

NXP Semiconductors

ACCELEROMETER 4-9G ANALOG 14LGA

0

MMA1250D

MMA1250D

NXP Semiconductors

ACCELEROMETER 5G ANALOG 16SOIC

0

MMA3221EG

MMA3221EG

NXP Semiconductors

ACCEL 50G/20G ANALOG 20SOIC

0

MMA1220KEG

MMA1220KEG

NXP Semiconductors

IC SENSOR ACCEL +/-8G 16-SOIC

0

MMA6262Q

MMA6262Q

NXP Semiconductors

ACCELEROMETER 1.5G ANALOG 16QFN

0

MMA6855AKGWR2

MMA6855AKGWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA6855LKWR2

MMA6855LKWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA7361LCR2

MMA7361LCR2

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA6855AKGCWR2

MMA6855AKGCWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA3202KEGR2

MMA3202KEGR2

NXP Semiconductors

ACCEL 112.5G/56.3G ANALOG 20SOIC

0

MMA1220D

MMA1220D

NXP Semiconductors

ACCELEROMETER 8G ANALOG 16SOIC

0

MMA6851LKCWR2

MMA6851LKCWR2

NXP Semiconductors

ACCELEROMETER 25G SPI 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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