Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA1210KEGR2

MMA1210KEGR2

NXP Semiconductors

ACCEL 112.5G ANALOG 16SOIC

0

MMA5248LVWR2

MMA5248LVWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA2612NIKWR2

MMA2612NIKWR2

NXP Semiconductors

ACCELEROMETER 125G PCM 16QFN

0

MMA5106NPIKWR2

MMA5106NPIKWR2

NXP Semiconductors

ACCELEROMETER DSI2.5 16QFN

0

MMA1254KEGR2

MMA1254KEGR2

NXP Semiconductors

ACCELEROMETER 5G ANALOG 16SOIC

0

PMMA1260KEGR2

PMMA1260KEGR2

NXP Semiconductors

IC ACCEL COLOSUS 1.5

0

MMA2725WR2

MMA2725WR2

NXP Semiconductors

ACCELEROMETER 250G PCM/SPI 16QFN

0

PMMA3202KEG

PMMA3202KEG

NXP Semiconductors

IC ACCEL SMT LN XY SOIC-20

0

MMA2725JWR2

MMA2725JWR2

NXP Semiconductors

ACCELEROMETER 16QFN

0

SX1532KVWT1

SX1532KVWT1

NXP Semiconductors

ACCELEROMETER

0

MMA5212ALWR2

MMA5212ALWR2

NXP Semiconductors

ACCELEROMETER 120G PCM/SPI 16QFN

0

SX2532KWT1

SX2532KWT1

NXP Semiconductors

ACCELEROMETER

0

MMA2712WR2

MMA2712WR2

NXP Semiconductors

ACCELEROMETER 125G PCM/SPI 16QFN

0

MMA5148NDIKGCWR2

MMA5148NDIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5206NDIKGWR2

MMA5206NDIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5124NPKGCWR2

MMA5124NPKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5248WR2

MMA5248WR2

NXP Semiconductors

ACCELEROMETER 480G 16QFN

0

MMA5124KWR2

MMA5124KWR2

NXP Semiconductors

ACCELEROMETER 240G PCM/SPI 16QFN

0

MMA2612IKGCWR2

MMA2612IKGCWR2

NXP Semiconductors

ACCELEROMETER 125G PCM 16QFN

0

MMA5224WR2

MMA5224WR2

NXP Semiconductors

ACCELEROMETER 240G 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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