Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA1213EGR2

MMA1213EGR2

NXP Semiconductors

ACCEL 56.3G ANALOG 16SOIC

0

MMA6361LT

MMA6361LT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA6826BKWR2

MMA6826BKWR2

NXP Semiconductors

ACCELEROMETER 60G SPI 16QFN

0

MMA7260QR2

MMA7260QR2

NXP Semiconductors

ACCEL 1.5-6G ANALOG 16QFN

0

MMA1200D

MMA1200D

NXP Semiconductors

ACCELEROMETER 281G ANALOG 16SOIC

0

MMA6222AEGR2

MMA6222AEGR2

NXP Semiconductors

ACCELEROMETER 20G ANALOG 20SOIC

0

MMA8491QT

MMA8491QT

NXP Semiconductors

ACCELEROMETER 8G I2C 12QFN

0

MMA3221KEGR2

MMA3221KEGR2

NXP Semiconductors

ACCEL 50G/20G ANALOG 20SOIC

0

MMA7368LT

MMA7368LT

NXP Semiconductors

ACCELEROMETER 1.5G ANALOG 14LGA

0

MMA6855ALKGCWR2

MMA6855ALKGCWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA1220EG

MMA1220EG

NXP Semiconductors

ACCELEROMETER 8G ANALOG 16SOIC

0

MMA7341LR1

MMA7341LR1

NXP Semiconductors

ACCELEROMETER 3-11G ANALOG 14LGA

0

MMA6805AKW

MMA6805AKW

NXP Semiconductors

ACCELEROMETER 16QFN

0

MMA6826AKGWR2

MMA6826AKGWR2

NXP Semiconductors

ACCELEROMETER 60G SPI 16QFN

0

MMA6222AEG

MMA6222AEG

NXP Semiconductors

ACCELEROMETER 20G ANALOG 20SOIC

0

MMA5224NDKGCWR2

MMA5224NDKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6821AKGWR2

MMA6821AKGWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA5206NPIKWR2

MMA5206NPIKWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5112LWR2

MMA5112LWR2

NXP Semiconductors

ACCELEROMETER 120G PCM/SPI 16QFN

0

PMMA2301KEGR2

PMMA2301KEGR2

NXP Semiconductors

IC ACCEL X- AXIS 200G NOMINAL

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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