Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA2201D

MMA2201D

NXP Semiconductors

ACCELEROMETER 45G ANALOG 16SOIC

0

MMA1201P

MMA1201P

NXP Semiconductors

ACCELEROMETER 38G ANALOG 16DIP

0

MMA7361LCR1

MMA7361LCR1

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA1200EGR2

MMA1200EGR2

NXP Semiconductors

ACCELEROMETER 281G ANALOG 16SOIC

0

MMA6281QT

MMA6281QT

NXP Semiconductors

ACCEL 2.5-10G ANALOG 16QFN

0

MMA2201EGR2

MMA2201EGR2

NXP Semiconductors

ACCELEROMETER 45G ANALOG 16SOIC

0

MMA6826AKGCWR2

MMA6826AKGCWR2

NXP Semiconductors

ACCELEROMETER 60G SPI 16QFN

0

MMA6900KQ

MMA6900KQ

NXP Semiconductors

ACCELEROMETER 3.5G PCM/SPI 16QFN

0

MMA6823ALKGCWR2

MMA6823ALKGCWR2

NXP Semiconductors

ACCELEROMETER 50G SPI 16QFN

0

MMA1270EGR2

MMA1270EGR2

NXP Semiconductors

ACCELEROMETER 2.5G ANALOG 16SOIC

0

MMA7368LR1

MMA7368LR1

NXP Semiconductors

ACCELEROMETER 1.5G ANALOG 14LGA

0

FXLS8964AFR1

FXLS8964AFR1

NXP Semiconductors

ACCELEROMETER 2-16G 10DFN

0

MMA7330LT

MMA7330LT

NXP Semiconductors

ACCELEROMETER 4-12G ANALOG 14LGA

0

MMA2201EG

MMA2201EG

NXP Semiconductors

ACCELEROMETER 45G ANALOG 16SOIC

0

MMA8204KEG

MMA8204KEG

NXP Semiconductors

ACCELEROMETER 16SOIC

0

MMA2240KEG574

MMA2240KEG574

NXP Semiconductors

SURFACE MOUNT MICROMACHINED ACCE

0

MMA8125EGR2

MMA8125EGR2

NXP Semiconductors

ACCEL 250G DSI/SPI 16SOIC

0

MMA7360L

MMA7360L

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA7360LT

MMA7360LT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA7456LR1

MMA7456LR1

NXP Semiconductors

ACCELEROMETER 2-8G I2C/SPI 14LGA

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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