Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA6270QT

MMA6270QT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 16QFN

0

MMA6280Q

MMA6280Q

NXP Semiconductors

ACCEL 1.5-6G ANALOG 16QFN

0

MMA6823AKGCWR2

MMA6823AKGCWR2

NXP Semiconductors

ACCELEROMETER 50G SPI 16QFN

0

MMA7455LR2

MMA7455LR2

NXP Semiconductors

ACCELEROMETER 2-8G I2C/SPI 14LGA

0

MMA1212EGR2

MMA1212EGR2

NXP Semiconductors

ACCELEROMETER 225G ANALOG 16SOIC

0

MMA6855BKWR2

MMA6855BKWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA6855LKCWR2

MMA6855LKCWR2

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA7261QR2

MMA7261QR2

NXP Semiconductors

ACCEL 2.5-10G ANALOG 16QFN

0

MMA6222EGR2

MMA6222EGR2

NXP Semiconductors

ACCELEROMETER 20G ANALOG 20SOIC

0

MMA1220EGR2

MMA1220EGR2

NXP Semiconductors

ACCELEROMETER 8G ANALOG 16SOIC

0

MMA1270D

MMA1270D

NXP Semiconductors

ACCELEROMETER 2.5G ANALOG 16SOIC

0

MMA1210D

MMA1210D

NXP Semiconductors

ACCEL 112.5G ANALOG 16SOIC

0

MMA6556KW

MMA6556KW

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

MMA2204EG

MMA2204EG

NXP Semiconductors

ACCEL 112.5G ANALOG 16SOIC

0

MMA6813BKWR2

MMA6813BKWR2

NXP Semiconductors

ACCELEROMETER 50G SPI 16QFN

0

MMA8104EG

MMA8104EG

NXP Semiconductors

ACCELEROMETER 40G DSI/SPI 16SOIC

0

MMA2202EG

MMA2202EG

NXP Semiconductors

ACCEL 56.3G ANALOG 16SOIC

0

MMA1211EGR2

MMA1211EGR2

NXP Semiconductors

ACCELEROMETER 169G ANALOG 16SOIC

0

MMA3202D

MMA3202D

NXP Semiconductors

ACCEL 112.5G/56.3G ANALOG 20SOIC

0

MMA8104KEG

MMA8104KEG

NXP Semiconductors

ACCELEROMETER 40G DSI/SPI 16SOIC

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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