Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA6853KWR2

MMA6853KWR2

NXP Semiconductors

ACCELEROMETER SPI 16QFN

0

MMA6260Q

MMA6260Q

NXP Semiconductors

ACCELEROMETER 1.5G ANALOG 16QFN

0

MMA7260QT

MMA7260QT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 16QFN

0

MMA6255EGR2

MMA6255EGR2

NXP Semiconductors

ACCELEROMETER 50G ANALOG 20SOIC

0

MMA7341LR2

MMA7341LR2

NXP Semiconductors

ACCELEROMETER 3-11G ANALOG 14LGA

0

MMA7340LT

MMA7340LT

NXP Semiconductors

ACCELEROMETER 3-11G ANALOG 14LGA

0

MMA1250EG

MMA1250EG

NXP Semiconductors

ACCELEROMETER 5G ANALOG 16SOIC

0

MMA6222EG

MMA6222EG

NXP Semiconductors

ACCELEROMETER 20G ANALOG 20SOIC

0

MMA6851BKWR2

MMA6851BKWR2

NXP Semiconductors

ACCELEROMETER 25G SPI 16QFN

0

MMA7268QR2

MMA7268QR2

NXP Semiconductors

ACCELEROMETER 1.5G 16QFN

0

MMA7341LCR2

MMA7341LCR2

NXP Semiconductors

ACCELEROMETER 3-9G ANALOG 14LGA

0

MMA6555KWR2

MMA6555KWR2

NXP Semiconductors

ACCELEROMETER 105G SPI 16QFN

0

MMA7660FCR1

MMA7660FCR1

NXP Semiconductors

ACCELEROMETER 1.5G I2C 10DFN

0

MMA7330LR2

MMA7330LR2

NXP Semiconductors

ACCELEROMETER 4-12G ANALOG 14LGA

0

MMA6280QT

MMA6280QT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 16QFN

0

MMA6851ALKGCWR2

MMA6851ALKGCWR2

NXP Semiconductors

ACCELEROMETER 25G SPI 16QFN

0

MMA1260EG

MMA1260EG

NXP Semiconductors

ACCEL 1.55G ANALOG 16SOIC

0

MMA7361LR1

MMA7361LR1

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA1213D

MMA1213D

NXP Semiconductors

ACCEL 56.3G ANALOG 16SOIC

0

MMA6827BKW

MMA6827BKW

NXP Semiconductors

ACCELEROMETER 120G SPI 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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