Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
LIS3L02AL

LIS3L02AL

STMicroelectronics

ACCELEROMETER 2G ANALOG 8LGA

0

MMA6821KW

MMA6821KW

NXP Semiconductors

ACCELEROMETER 120G/25G SPI 16QFN

0

MMA6825KVWR2

MMA6825KVWR2

NXP Semiconductors

IC SENSOR ACCEL DUAL AXIS 16QFN

0

MMA6222KEGR2

MMA6222KEGR2

NXP Semiconductors

ACCELEROMETER 20G ANALOG 20SOIC

0

MMA6261QR2

MMA6261QR2

NXP Semiconductors

ACCELEROMETER 1.5G ANALOG 16QFN

0

LIS2L02AQ3TR

LIS2L02AQ3TR

STMicroelectronics

ACCELEROMETER 2-6G ANALOG 44QFN

0

MMA6900KQR2

MMA6900KQR2

NXP Semiconductors

ACCELEROMETER 3.5G PCM/SPI 16QFN

0

MMA8205KEGR2

MMA8205KEGR2

NXP Semiconductors

IC SENSOR ACCEL X-AXIS SOIC16

0

E-LIS3L02AS4

E-LIS3L02AS4

STMicroelectronics

ACCELEROMETER 2-6G ANALOG 24SO

0

SCA610-CC5H1A

SCA610-CC5H1A

TOKO / Murata

ACCELEROMETER 3G ANALOG 8SMD

0

MMA7361LCT

MMA7361LCT

NXP Semiconductors

ACCEL 1.5-6G ANALOG 14LGA

0

MMA7331LCR2

MMA7331LCR2

NXP Semiconductors

ACCELEROMETER 4-9G ANALOG 14LGA

0

70002337

70002337

Digi

ACCELEROMETER 2G

0

MMA7368FLR1

MMA7368FLR1

NXP Semiconductors

ACCELEROMETER 1.5G 14LGA

0

LIS331DLMTR

LIS331DLMTR

STMicroelectronics

ACCELEROMETER 2-8G I2C/SPI 16LGA

0

LIS3DH

LIS3DH

STMicroelectronics

ACCEL 2-16G I2C/SPI 16LGA

0

MXC6226XC (DTOS WLP)

MXC6226XC (DTOS WLP)

MEMSIC

ACCELEROMETER 2G I2C 6CSP

0

LIS244ALTR

LIS244ALTR

STMicroelectronics

ACCELEROMETER 2-6G ANALOG 16LGA

0

LIS3L02DQ

LIS3L02DQ

STMicroelectronics

ACCELEROMETER 2G I2C/SPI 44QFN

0

MMA7341LT

MMA7341LT

NXP Semiconductors

ACCELEROMETER 3-11G ANALOG 14LGA

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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