Magnetic Sensors - Linear, Compass (ICs)

Image	Part Number	Description / PDF	Quantity	Rfq
	MLX90215LVA-LA03 Melexis	SENSOR HALL EFFECT ANALOG 4SIP	0
	A1383ELHLT-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG SOT23W	0
	A1321ELHLT-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG SOT23W	0
	A1302KUATI-T Allegro MicroSystems	IC LINEAR HALL SENSOR 3SIP	0
	HMC6042-TR Honeywell Aerospace	SENSOR MR WHEAT BRDG 20LCC	0
	A1301EUA-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG 3SIP	0
	KMZ43T,118 NXP Semiconductors	SENSOR MR ANALOG 8SO	0
	HMC1043-TR Honeywell Aerospace	SENSOR MR WHEAT BRDG 16LPCC	0
	A1321LLHLT-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG SOT23W	0
	A1323LUA-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG 3SIP	0
	A1321LUA Allegro MicroSystems	SENSOR HALL EFFECT ANALOG 3SIP	0
	ZMZ20M Zetex Semiconductors (Diodes Inc.)	SENSOR MR ANALOG 4SIP	0
	A1323ELHLT-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG SOT23W	0
	A1309LUA-9-T Allegro MicroSystems	IC SENSOR HALL EFFECT 3SIP	0
	A1321ELHLT Allegro MicroSystems	SENSOR HALL EFFECT ANALOG SOT23W	0
	HMC1021D Honeywell Aerospace	SENSOR MR WHEAT BRDG 8CDIP	0
	A1383EUA-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG 3SIP	0
	MLX90295EVC-FAA-200-BU Melexis	SENSOR HALL EFFECT ANALOG 4SIP	0
	HMC1052 Honeywell Aerospace	SENSOR MR WHEAT BRDG 10MSOP	0
	A1361LKTTN-T Allegro MicroSystems	SENSOR HALL EFFECT ANALOG 4SIP	0

Magnetic Sensors - Linear, Compass (ICs)

1. Overview

Magnetic sensors - linear compass ICs are semiconductor devices that detect magnetic fields and convert them into electrical signals. These integrated circuits provide precise measurement of magnetic field direction and strength in linear axes, enabling 2D/3D orientation detection. Their importance spans multiple industries due to their ability to provide contactless position sensing, navigation capabilities, and magnetic field monitoring in compact form factors.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Hall Effect Sensors	Voltage output proportional to magnetic field strength, simple design	Current sensing, proximity detection
Anisotropic Magnetoresistance (AMR) Sensors	High sensitivity (0.1 accuracy), low power consumption	Electronic compasses, navigation systems
Giant Magnetoresistance (GMR) Sensors	Ultra-high sensitivity (nanotesla range), wide bandwidth	Biomedical devices, industrial position control
Tunneling Magnetoresistance (TMR) Sensors	Lowest power consumption, excellent thermal stability	IoT devices, automotive safety systems

3. Structure & Composition

Typical construction includes: - Sensing element (Hall plate/AMR film/TMR junction) - Signal conditioning circuitry (amplifiers, ADCs) - Temperature compensation modules - Digital interface (I2C/SPI) Packaged in LGA/QFN formats (2-8mm sizes) with magnetic shielding layers. Advanced versions integrate sensor fusion algorithms for 3-axis measurement.

4. Key Technical Specifications

Parameter	Description & Importance
Sensitivity (mV/Gauss)	Determines minimum detectable field strength
Resolution ( T/LSB)	Affects angle measurement precision (critical for navigation)
Operating Temperature (-40 to +125 C)	Defines environmental suitability
Power Consumption ( A/mA)	Crucial for battery-powered devices
Interface Type	I2C/SPI for digital output, analog for raw signals

5. Application Fields

Main industries include: - Consumer Electronics: Smartphone compasses, AR/VR headsets - Automotive: EPS systems, vehicle detection - Industrial: Robotics, CNC machine tool positioning - Aerospace: Drone stabilization systems - Medical: Surgical tool tracking

6. Leading Manufacturers & Products

Manufacturer	Product Series	Key Specifications
STMicroelectronics	LIS3MDL	50 Gauss range, 0.08 T/LSB, I2C/SPI
Honeywell	HMC5883L	80 Hz bandwidth, 2-4 Gauss accuracy
NXP Semiconductors	MFX7755	3D sensing, 0.1 heading accuracy
TDK-InvenSense	ICM-20948	9-axis MEMS+mag, 0.15 mA operating current

7. Selection Guidelines

Key consideration factors: - Required measurement axis (2D vs 3D) - Environmental conditions (temperature, vibration) - Power budget constraints - Required accuracy vs cost trade-offs - Interface compatibility with host system - Calibration requirements (hard/soft iron compensation)

8. Industry Trends

Current development directions: - Integration with MEMS IMUs for sensor fusion - AI-based self-calibration algorithms - Sub-10 A ultra-low power consumption - Increased radiation hardness for space applications - Development of 4D magnetic field-time sensors