RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
0097029002

0097029002

Laird - Performance Materials

CSTR,STR,BF

0

8863-0110-72

8863-0110-72

Laird - Performance Materials

EMI

0

0097094104

0097094104

Laird - Performance Materials

FLX,STR,AG .170X.195X.188X24

0

4211AB51K08400

4211AB51K08400

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4054AB51K09600

4054AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 LSH

0

8516-0168-50

8516-0168-50

Laird - Performance Materials

MILCONNECTOR,ECE050 1.38X1.63X1.

0

4742PA51H01200

4742PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4375AC51K09600

4375AC51K09600

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

4522PA51G04800

4522PA51G04800

Laird - Performance Materials

GK NICU NRSG PU V0 SQ

0

4084PA51G08500

4084PA51G08500

Laird - Performance Materials

GK NICU NRSG PU V0 SQ

0

4283PA51H00360

4283PA51H00360

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4701AB51K09600

4701AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4224AB51H02230

4224AB51H02230

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4054AB51H08400

4054AB51H08400

Laird - Performance Materials

GK NICU PTAFG PU V0 LSH

0

4233AB51K08400

4233AB51K08400

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4053PA51H00450

4053PA51H00450

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4B40HC51K00472

4B40HC51K00472

Laird - Performance Materials

GK NICU NRS PU V0 DSH

0

0C97054206

0C97054206

Laird - Performance Materials

NOSG,COIL,CDC,PSA .080X.250X.188

0

4219AE51K01800

4219AE51K01800

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4F73AD51H09600

4F73AD51H09600

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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