RF Multiplexers

Image Part Number Description / PDF Quantity Rfq
DPX255950DT-5120A1

DPX255950DT-5120A1

TDK Corporation

RF DIPLEXER 2.45/5.425GHZ 0805

0

DPX165850DT-8117A1

DPX165850DT-8117A1

TDK Corporation

RF DIPLEXER 2.5GHZ/5.85GHZ 0603

3504

DPX105850DT-6019A1

DPX105850DT-6019A1

TDK Corporation

RF DIPLEXER 2.45GHZ/5.5GHZ 0402

7380

D6PF1G960M3B6-Z

D6PF1G960M3B6-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

1168

D6DA2G140K2A7-Z

D6DA2G140K2A7-Z

TAIYO YUDEN

RF DUPLEXER 8SMD NO LEAD

1092

DPX202690DT-4049A2

DPX202690DT-4049A2

TDK Corporation

RF DIPLEXER 832MHZ/2.2GHZ 0805

961

D6HQ1G962DP39-Z

D6HQ1G962DP39-Z

TAIYO YUDEN

RF DUPLEXER 1.8825/1.962GHZ 8SMD

3000

MAFL-011078

MAFL-011078

Metelics (MACOM Technology Solutions)

RF DIPLEXER 42/54MHZ SMD

10001000

DPX165850DT-8033B1

DPX165850DT-8033B1

TDK Corporation

RF DIPLEXER 0603 6 PC PAD

7138

DPX202700DT-4062A1

DPX202700DT-4062A1

TDK Corporation

RF DIPLEXER 829MHZ/2.3GHZ 0805

17372

DP05A1940TTR

DP05A1940TTR

Elco (AVX)

RF DIPLEXER 892MHZ/1.94GHZ 0805

0

D5DA782M0K2J6-Z

D5DA782M0K2J6-Z

TAIYO YUDEN

RF DUPLEXER 751MHZ/782MHZ 8SMD

529

DPX202700DT-4162A1

DPX202700DT-4162A1

TDK Corporation

MULTILAYER DIPLEXER FOR 698 - 96

1036

DP03B5425TTR/500

DP03B5425TTR/500

Elco (AVX)

RF DIPLEXER 0603 6 PC PAD

0

FAR-D5NG-881M50-M11Z-Z

FAR-D5NG-881M50-M11Z-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

200000108

200000108

Amphenol

DPF 2/6 H-6/8 N..

100

DPX202690DT-4149A2

DPX202690DT-4149A2

TDK Corporation

RF DIPLEXER 832MHZ/2.2GHZ 0805

116

TPX252690MT-7029A1

TPX252690MT-7029A1

TDK Corporation

MULTILAYER TRIPLEXER FOR 698 - 9

2985

B39851B8030P810

B39851B8030P810

RF360 - A Qualcomm-TDK joint venture

RF DUPLEXER 9SMD NO LEAD

4117

D5PF773M0M3Y6-Z

D5PF773M0M3Y6-Z

TAIYO YUDEN

RF DUPLEXER 718MHZ/773MHZ 9SMD

3195

RF Multiplexers

1. Overview

RF/IF multiplexers are devices that route high-frequency signals (typically 300 MHz to 6 GHz for RF, and 10 MHz to 1 GHz for IF) between multiple channels. RFID RF multiplexers specialize in managing signals for radio frequency identification systems (125 kHz to 900 MHz). These components enable efficient signal management in wireless communication, industrial automation, and IoT systems, reducing hardware complexity and cost.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Coaxial RF MultiplexerMechanical switching with high power handling (up to 100W)Test equipment, military communication
MMIC-based MultiplexerMonolithic Microwave IC integration, fast switching ( 1 s)5G base stations, phased array systems
UHF RFID MultiplexerSupports EPCglobal Gen2 protocol, 8-16 portsWarehouse inventory management
Fiber-Optic RF MultiplexerOptical signal routing, low insertion loss (<1 dB)Aerospace telemetry systems

3. Structure and Components

Typical construction includes: - Switch matrix (electromechanical relays or PIN diodes) - RF shielding enclosure (aluminum alloy) - SMA/N-type connectors - Control circuitry (TTL/CMOS interface) - Dielectric substrate (RO4000 series for high frequencies)

4. Key Technical Specifications

ParameterValue RangeImportance
Frequency RangeDC-18 GHzDetermines application compatibility
Insertion Loss0.3-3.5 dBSignal integrity preservation
Isolation20-80 dBPrevents channel cross-talk
Switching Speed10 s-10 msAffects system response time
VSWR1.2:1-2.0:1Impedance matching quality indicator

5. Application Fields

  • Telecom: Base station antenna sharing
  • Medical: MRI RF coil switching
  • Manufacturing: Automated test equipment (ATE)
  • Logistics: RFID warehouse tracking systems

6. Leading Manufacturers and Products

VendorProduct SeriesKey Features
Analog DevicesADG9xxCMOS-based, 0.1-3 GHz, 1.8-5.5V supply
Keysight TechnologiesU2000 SeriesOptical RF multiplexer with 0.05 dB accuracy
Nordic SemiconductornRF24 2.4 GHz, -94 dBm sensitivity for RFID
TE ConnectivityRF Multiplex SwitchIP67 rated for outdoor deployment

7. Selection Guidelines

Consider: 1. Frequency match with application band 2. Signal power handling requirements 3. Environmental conditions (temperature/humidity) 4. Control interface compatibility (SPI/UART) 5. Port count scalability 6. Cost vs. performance trade-offs

8. Industry Trends

Current developments include: - Integration with AI for dynamic signal path optimization - Sub-6 GHz 5G MIMO support expansion - Development of reconfigurable intelligent surfaces (RIS) - RFID multiplexers with embedded sensing capabilities - Miniaturization using LTCC packaging technology

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