RF Multiplexers

Image Part Number Description / PDF Quantity Rfq
B39781B7939P810S03

B39781B7939P810S03

RF360 - A Qualcomm-TDK joint venture

FILTER SAW 2520 SMD

0

SD25-0836R8UU31

SD25-0836R8UU31

KYOCERA Corporation

RF DUPLEXER 836.5/881.5MHZ 8SMD

0

ACMD-6107-SY1

ACMD-6107-SY1

Broadcom

RF DUPLEXER 2.535/2.655GHZ 8QFN

0

D5GK942M5D1KB-Z

D5GK942M5D1KB-Z

TAIYO YUDEN

RF DUPLEXER

0

B39182B8008P810W99

B39182B8008P810W99

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER MOBILE SMD

0

2450DM41A5400

2450DM41A5400

Johanson Technology

RF DIPLEXER MODULE

0

B39202B1262L210

B39202B1262L210

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER SMD

0

ACMD-7602-BLKG

ACMD-7602-BLKG

Broadcom

RF DUPLEXER 1.95GHZ/2.14GHZ 3CSP

0

B38262W1181W310

B38262W1181W310

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER SMD

0

ACMD-6225-TR1

ACMD-6225-TR1

Broadcom

DUPLEXER BAND 25 1.4X1.8MM SMD

0

ACMD-6126-TR1

ACMD-6126-TR1

Broadcom

RF DUPLEXER FBAR

0

ACFM-7310-BLK

ACFM-7310-BLK

Broadcom

BC0DUP+BC1DUP+B4RX QUINTPLEXER

0

CX6052L

CX6052L

PulseLarsen Antenna

RF DIPLEXER

0

CX6046NL

CX6046NL

PulseLarsen Antenna

RF DIPLEXER

0

B39941B8516P810S5

B39941B8516P810S5

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER MOBILE SMD

0

SD25-0827R8UU01

SD25-0827R8UU01

KYOCERA Corporation

RF DUPLEXER 827MHZ/872MHZ 8SMD

0

D5GG872M0D1GA-Z

D5GG872M0D1GA-Z

TAIYO YUDEN

RF DUPLEXER

0

D6PF1G960M3B9-Z

D6PF1G960M3B9-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

0734700037

0734700037

Woodhead - Molex

DIPLEXER 12700-13200MHZ

0

D5GD942M5D1DF-Z

D5GD942M5D1DF-Z

TAIYO YUDEN

RF DUPLEXER

0

RF Multiplexers

1. Overview

RF/IF multiplexers are devices that route high-frequency signals (typically 300 MHz to 6 GHz for RF, and 10 MHz to 1 GHz for IF) between multiple channels. RFID RF multiplexers specialize in managing signals for radio frequency identification systems (125 kHz to 900 MHz). These components enable efficient signal management in wireless communication, industrial automation, and IoT systems, reducing hardware complexity and cost.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Coaxial RF MultiplexerMechanical switching with high power handling (up to 100W)Test equipment, military communication
MMIC-based MultiplexerMonolithic Microwave IC integration, fast switching ( 1 s)5G base stations, phased array systems
UHF RFID MultiplexerSupports EPCglobal Gen2 protocol, 8-16 portsWarehouse inventory management
Fiber-Optic RF MultiplexerOptical signal routing, low insertion loss (<1 dB)Aerospace telemetry systems

3. Structure and Components

Typical construction includes: - Switch matrix (electromechanical relays or PIN diodes) - RF shielding enclosure (aluminum alloy) - SMA/N-type connectors - Control circuitry (TTL/CMOS interface) - Dielectric substrate (RO4000 series for high frequencies)

4. Key Technical Specifications

ParameterValue RangeImportance
Frequency RangeDC-18 GHzDetermines application compatibility
Insertion Loss0.3-3.5 dBSignal integrity preservation
Isolation20-80 dBPrevents channel cross-talk
Switching Speed10 s-10 msAffects system response time
VSWR1.2:1-2.0:1Impedance matching quality indicator

5. Application Fields

  • Telecom: Base station antenna sharing
  • Medical: MRI RF coil switching
  • Manufacturing: Automated test equipment (ATE)
  • Logistics: RFID warehouse tracking systems

6. Leading Manufacturers and Products

VendorProduct SeriesKey Features
Analog DevicesADG9xxCMOS-based, 0.1-3 GHz, 1.8-5.5V supply
Keysight TechnologiesU2000 SeriesOptical RF multiplexer with 0.05 dB accuracy
Nordic SemiconductornRF24 2.4 GHz, -94 dBm sensitivity for RFID
TE ConnectivityRF Multiplex SwitchIP67 rated for outdoor deployment

7. Selection Guidelines

Consider: 1. Frequency match with application band 2. Signal power handling requirements 3. Environmental conditions (temperature/humidity) 4. Control interface compatibility (SPI/UART) 5. Port count scalability 6. Cost vs. performance trade-offs

8. Industry Trends

Current developments include: - Integration with AI for dynamic signal path optimization - Sub-6 GHz 5G MIMO support expansion - Development of reconfigurable intelligent surfaces (RIS) - RFID multiplexers with embedded sensing capabilities - Miniaturization using LTCC packaging technology

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