RF Multiplexers

Image Part Number Description / PDF Quantity Rfq
D6JG2G132D3GZ-Z

D6JG2G132D3GZ-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

B39182B9522P810

B39182B9522P810

RF360 - A Qualcomm-TDK joint venture

RF DIPLEX 942.5MHZ/1.8425GHZ SMD

0

B39212B8571P810

B39212B8571P810

RF360 - A Qualcomm-TDK joint venture

RF DUPLEXER 1.7325/2.1325GHZ SMD

0

ACMD-7612-TR1

ACMD-7612-TR1

Broadcom

RF DUPLEXER 1.95GHZ/2.14GHZ 3CSP

0

B39741B8649P810

B39741B8649P810

RF360 - A Qualcomm-TDK joint venture

RF DIPLEXER 707.5/737.5MHZ 8SMD

0

B39182B8557P810

B39182B8557P810

RF360 - A Qualcomm-TDK joint venture

RF DUPLEXER 1.7674/1.8624GHZ SMD

0

SD25-0827R8UU00

SD25-0827R8UU00

KYOCERA Corporation

RF DUPLEXER 827MHZ/872MHZ 8SMD

0

B39212B8550P810W99

B39212B8550P810W99

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER MOBILE SMD

0

ACMD-6107-TR1

ACMD-6107-TR1

Broadcom

RF DUPLEXER 2.535/2.655GHZ 8QFN

0

SD25-0836R8UU01

SD25-0836R8UU01

KYOCERA Corporation

RF DUPLEXER 836.5/881.5MHZ 8SMD

0

B38791W1155W310

B38791W1155W310

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER SMD

0

CX6026SNL

CX6026SNL

PulseLarsen Antenna

RF DIPLEXER 24.5MHZ/459MHZ MOD

0

FAR-D5PE-881M50-P3EY-Z

FAR-D5PE-881M50-P3EY-Z

TAIYO YUDEN

RF DUPLEXER 9SMD NO LEAD

0

0734700042

0734700042

Woodhead - Molex

DIPLEXER 14300-15400MHZ

0

ACFM-2013-SG1

ACFM-2013-SG1

Broadcom

IC QUADPLEXER B1+B3

0

ACFM-2024-SG1

ACFM-2024-SG1

Broadcom

RF TRIPLEXER 10TDFN EXPOSED PAD

0

B39881B8506P810S5

B39881B8506P810S5

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER MOBILE SMD

0

ACMD-6103-TR1

ACMD-6103-TR1

Broadcom

RF DUPLEXER 1.7475/1.8425GHZ SMD

0

SD25-1732R9UBA1

SD25-1732R9UBA1

KYOCERA Corporation

DUPLEXER SAW 8SMD

0

B38791W1151W310

B38791W1151W310

RF360 - A Qualcomm-TDK joint venture

SAW DUPLEXER SMD

0

RF Multiplexers

1. Overview

RF/IF multiplexers are devices that route high-frequency signals (typically 300 MHz to 6 GHz for RF, and 10 MHz to 1 GHz for IF) between multiple channels. RFID RF multiplexers specialize in managing signals for radio frequency identification systems (125 kHz to 900 MHz). These components enable efficient signal management in wireless communication, industrial automation, and IoT systems, reducing hardware complexity and cost.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Coaxial RF MultiplexerMechanical switching with high power handling (up to 100W)Test equipment, military communication
MMIC-based MultiplexerMonolithic Microwave IC integration, fast switching ( 1 s)5G base stations, phased array systems
UHF RFID MultiplexerSupports EPCglobal Gen2 protocol, 8-16 portsWarehouse inventory management
Fiber-Optic RF MultiplexerOptical signal routing, low insertion loss (<1 dB)Aerospace telemetry systems

3. Structure and Components

Typical construction includes: - Switch matrix (electromechanical relays or PIN diodes) - RF shielding enclosure (aluminum alloy) - SMA/N-type connectors - Control circuitry (TTL/CMOS interface) - Dielectric substrate (RO4000 series for high frequencies)

4. Key Technical Specifications

ParameterValue RangeImportance
Frequency RangeDC-18 GHzDetermines application compatibility
Insertion Loss0.3-3.5 dBSignal integrity preservation
Isolation20-80 dBPrevents channel cross-talk
Switching Speed10 s-10 msAffects system response time
VSWR1.2:1-2.0:1Impedance matching quality indicator

5. Application Fields

  • Telecom: Base station antenna sharing
  • Medical: MRI RF coil switching
  • Manufacturing: Automated test equipment (ATE)
  • Logistics: RFID warehouse tracking systems

6. Leading Manufacturers and Products

VendorProduct SeriesKey Features
Analog DevicesADG9xxCMOS-based, 0.1-3 GHz, 1.8-5.5V supply
Keysight TechnologiesU2000 SeriesOptical RF multiplexer with 0.05 dB accuracy
Nordic SemiconductornRF24 2.4 GHz, -94 dBm sensitivity for RFID
TE ConnectivityRF Multiplex SwitchIP67 rated for outdoor deployment

7. Selection Guidelines

Consider: 1. Frequency match with application band 2. Signal power handling requirements 3. Environmental conditions (temperature/humidity) 4. Control interface compatibility (SPI/UART) 5. Port count scalability 6. Cost vs. performance trade-offs

8. Industry Trends

Current developments include: - Integration with AI for dynamic signal path optimization - Sub-6 GHz 5G MIMO support expansion - Development of reconfigurable intelligent surfaces (RIS) - RFID multiplexers with embedded sensing capabilities - Miniaturization using LTCC packaging technology

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