| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
NXP Semiconductors |
T1023 WLAN DEVELOPMENT PLATFORM |
0 |
|
|
NXP Semiconductors |
FREEDOM DEVELOPMENT PLATFORM KI |
0 |
|
|
NXP Semiconductors |
SA639DH DEMOBOARD |
0 |
|
|
NXP Semiconductors |
SA6X4AHR EVALUATION DEMO BOARD |
0 |
|
|
NXP Semiconductors |
BOARD PWR PACK RADIO JA |
0 |
|
|
NXP Semiconductors |
KIT DEV NETWORK 13234 W/BDM |
0 |
|
|
NXP Semiconductors |
JN5189 USB DONGLE |
12 |
|
|
NXP Semiconductors |
KIT EVAL ADAM 2.1GHZ |
0 |
|
|
NXP Semiconductors |
MRFE6VP5600 REF BOARD - 225 |
2 |
|
|
NXP Semiconductors |
TOWER MODULE FOR NA |
0 |
|
|
NXP Semiconductors |
QN9020 DEVELOPMENT KIT |
0 |
|
|
NXP Semiconductors |
OM15080-K32W |
24 |
|
|
NXP Semiconductors |
1323X_NETWORK_PLUS |
0 |
|
|
NXP Semiconductors |
SA630D DEMOBOARD |
0 |
|
|
NXP Semiconductors |
QN9090 BLE SOC DEV KIT |
18 |
|
|
NXP Semiconductors |
KIT DEV FOR 1323X_NETWORK |
0 |
|
|
NXP Semiconductors |
FREEDOM BOARD FOR KW SERIES |
0 |
|
|
NXP Semiconductors |
RAPID-IOT TO DRONE ADAPTER BOARD |
0 |
|
|
NXP Semiconductors |
PLATFORM REF DESIGN WLAN P1023 |
0 |
|
|
NXP Semiconductors |
MRFE6VP61K25H REF BRD 230MHZ |
2 |
|
RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) evaluation and development kits are hardware platforms designed to facilitate the testing, prototyping, and optimization of wireless communication systems. These kits enable engineers to validate circuit performance, debug protocols, and accelerate product development. They play a critical role in modern technologies such as IoT, 5G, smart logistics, and industrial automation by bridging theoretical design and real-world deployment.
| Type | Functional Features | Application Examples |
|---|---|---|
| RF Evaluation Boards | Focus on RF signal generation, modulation/demodulation, and impedance matching testing | 5G base station prototyping, Wi-Fi 6 module testing |
| RFID Development Kits | Support NFC, UHF/HF RFID tag/reader development with protocol analysis | Smart retail payment systems, asset tracking solutions |
| Multifunctional Development Boards | Integrate RF, microcontroller, and sensor interfaces for system-level testing | Industrial IoT gateway development, drone communication modules |
Typical products consist of: - Base PCB: Multilayer board with RF shielding compartments - RF Front-End: Includes LNA (Low Noise Amplifier), PA (Power Amplifier), and frequency synthesizers - Processing Unit: Embedded FPGA or MCU for real-time signal processing - Interface Ports: USB-C, SMA connectors, GPIO headers for peripheral expansion - Power Management: Regulated voltage supplies for different RF components
| Parameter | Description | Importance |
|---|---|---|
| Frequency Range | Operational bandwidth (e.g., 300 MHz - 6 GHz) | Determines application compatibility |
| Output Power | Transmit power level (e.g., -20 to +20 dBm) | Impacts communication distance and FCC compliance |
| Receiver Sensitivity | Minimum detectable signal level (e.g., -120 dBm) | Affects signal reliability in noisy environments |
| Impedance Matching | VSWR (Voltage Standing Wave Ratio) 2:1 | Ensures minimal signal reflection |
| Power Supply Requirements | Voltage/current specifications (e.g., 3.3V 5%) | Critical for system integration |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | AFE7444EVM | Quad-channel RF-sampling transceiver evaluation |
| STMicroelectronics | ST25RU3993-DISCO | UHF RFID reader IC development kit |
| Nordic Semiconductor | nRF52840-DK | Bluetooth 5.2 and Thread protocol testing |
| Impinj | Speedway R420 | UHF Gen2 RFID reader for logistics automation |
Key considerations include: - Frequency Compatibility: Match kit range with target application (e.g., Sub-1GHz vs 2.4GHz) - Development Ecosystem: Availability of SDKs, simulation software, and community support - Scalability: Modular design for future hardware expansion - Compliance Certifications: Pre-tested for FCC/CE regulatory standards - Cost-Performance Ratio: Balance between feature set and project budget
Emerging trends include: - Millimeter-wave Integration: Development kits supporting 24GHz+ for automotive radar - AI-Driven Testing: Embedded machine learning algorithms for signal optimization - Energy Harvesting Support: Ultra-low power RF modules for battery-free IoT devices - Cloud Integration: Over-the-air firmware updates and remote diagnostics - Standardization: Unified platform architectures across multiple vendors