Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	SQS16A5100JSLF TT Electronics / BI Technologies	RES ARRAY 8 RES 510 OHM 16SSOP	0
	SFN08B1003CBQLF7 TT Electronics / BI Technologies	RES ARRAY 7 RES 100K OHM 8DFN	0
	SFN06VD07CBQLF7 TT Electronics / BI Technologies	RES NETWORK 2 RES MULT OHM 6DFN	0
	SQS20B1001GSLF TT Electronics / BI Technologies	RES ARRAY 19 RES 1K OHM 20SSOP	0
	SFN06VD05CBQLF7 TT Electronics / BI Technologies	RES NETWORK 2 RES 20K OHM 6DFN	0
	SFN06VD03CBQLF7 TT Electronics / BI Technologies	RES NETWORK 2 RES MULT OHM 6DFN	0
	SQS16B2001GSLF TT Electronics / BI Technologies	RES ARRAY 15 RES 2K OHM 16SSOP	0
	SQS16B1002GSLF TT Electronics / BI Technologies	RES ARRAY 15 RES 10K OHM 16SSOP	0
	SQS16A1001JSLF TT Electronics / BI Technologies	RES ARRAY 8 RES 1K OHM 16SSOP	0
	668A1002BLF TT Electronics / BI Technologies	RES ARRAY 8 RES 10K OHM 16SOIC	0
	SQS20B1501GSLF TT Electronics / BI Technologies	RES ARRAY 19 RES 1.5K OHM 20SSOP	0
	SQS24B5101GSLF TT Electronics / BI Technologies	RES ARRAY 23 RES 5.1K OHM 24SSOP	0
	SFN08A1002CBQLF7 TT Electronics / BI Technologies	RES ARRAY 4 RES 10K OHM 8DFN	0
	SQS24B4701GSLF TT Electronics / BI Technologies	RES ARRAY 23 RES 4.7K OHM 24SSOP	0
	SFN08A4702CBQLF7 TT Electronics / BI Technologies	RES ARRAY 4 RES 47K OHM 8DFN	0
	SQS24B5001GSLF TT Electronics / BI Technologies	RES ARRAY 23 RES 5K OHM 24SSOP	0
	SQS24B1002GSLF TT Electronics / BI Technologies	RES ARRAY 23 RES 10K OHM 24SSOP	0
	SFN08A1003CBQLF7 TT Electronics / BI Technologies	RES ARRAY 4 RES 100K OHM 8DFN	0
	SFN08A1001CBQLF7 TT Electronics / BI Technologies	RES ARRAY 4 RES 1K OHM 8DFN	0
	SFN08A4701CBQLF7 TT Electronics / BI Technologies	RES ARRAY 4 RES 4.7K OHM 8DFN	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages