Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
YC162-FR-0760K4L Yageo	RES ARRAY 2 RES 60.4K OHM 0606	0
AF164-FR-07127RL Yageo	RES ARRAY 4 RES 127 OHM 1206	0
AF164-FR-071K62L Yageo	RES ARRAY 4 RES 1.62K OHM 1206	0
YC248-JR-0710RL Yageo	RES ARRAY 8 RES 10 OHM 1606	910
YC164-JR-07150RL Yageo	RES ARRAY 4 RES 150 OHM 1206	54457
YC248-FR-0791RL Yageo	RES ARRAY 8 RES 91 OHM 1606	0
YC162-FR-074K99L Yageo	RES ARRAY 2 RES 4.99K OHM 0606	0
YC248-FR-07270KL Yageo	RES ARRAY 8 RES 270K OHM 1606	0
YC248-FR-07237KL Yageo	RES ARRAY 8 RES 237K OHM 1606	0
YC162-FR-0790K9L Yageo	RES ARRAY 2 RES 90.9K OHM 0606	0
YC162-FR-07499RL Yageo	RES ARRAY 2 RES 499 OHM 0606	0
YC124-FR-0730RL Yageo	RES ARRAY 4 RES 30 OHM 0804	0
AF164-FR-0716K9L Yageo	RES ARRAY 4 RES 16.9K OHM 1206	0
AF164-FR-07140RL Yageo	RES ARRAY 4 RES 140 OHM 1206	0
AF164-JR-072K7L Yageo	RES ARRAY 4 RES 2.7K OHM 1206	0
TC124-FR-0749R9L Yageo	RES ARRAY 4 RES 49.9 OHM 0804	0
TC124-FR-074K53L Yageo	RES ARRAY 4 RES 4.53K OHM 0804	0
YC324-FK-0749K9L Yageo	RES ARRAY 4 RES 49.9K OHM 2012	0
AF164-FR-07162RL Yageo	RES ARRAY 4 RES 162 OHM 1206	0
YC324-FK-07205RL Yageo	RES ARRAY 4 RES 205 OHM 2012	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages