Arrays/Networks Resistors

Image	Part Number	Description / PDF	Quantity	Rfq
	RAVF164DFT13K0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 13K OHM 1206	0
	RAVF104DJT39R0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 39 OHM 0804	0
	RAVF104DJT4K30 Stackpole Electronics, Inc.	RES ARRAY 4 RES 4.3K OHM 0804	0
	RAVF104DJT2K40 Stackpole Electronics, Inc.	RES ARRAY 4 RES 2.4K OHM 0804	0
	RAVF104DFT150R Stackpole Electronics, Inc.	RES ARRAY 4 RES 150 OHM 0804	0
	RAVF162DJT510R Stackpole Electronics, Inc.	RES ARRAY 2 RES 510 OHM 0606	0
	RAVF164DJT62R0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 62 OHM 1206	0
	RAVF164DFT30R0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 30 OHM 1206	0
	RAVF164DJT750K Stackpole Electronics, Inc.	RES ARRAY 4 RES 750K OHM 1206	0
	RAVF104DJT1R10 Stackpole Electronics, Inc.	RES ARRAY 4 RES 1.1 OHM 0804	0
	RAVF168DJT43R0 Stackpole Electronics, Inc.	RES ARRAY 8 RES 43 OHM 1506	0
	RAVF104DFT75R0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 75 OHM 0804	0
	RAVF102DJT4K70 Stackpole Electronics, Inc.	RES ARRAY 2 RES 4.7K OHM 0404	0
	RAVF104DFT16R0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 16 OHM 0804	0
	RAVF164DFT12K0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 12K OHM 1206	0
	RAVF164DFT680R Stackpole Electronics, Inc.	RES ARRAY 4 RES 680 OHM 1206	0
	RAVF102DJT75R0 Stackpole Electronics, Inc.	RES ARRAY 2 RES 75 OHM 0404	0
	RAVF104DJT200R Stackpole Electronics, Inc.	RES ARRAY 4 RES 200 OHM 0804	0
	RAVF104DJT110R Stackpole Electronics, Inc.	RES ARRAY 4 RES 110 OHM 0804	0
	RAVF164DFT2K20 Stackpole Electronics, Inc.	RES ARRAY 4 RES 2.2K OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages