Signal Relays, Up to 2 Amps

Part Number	Description / PDF	Quantity
G6A 1083B Waldom Electronics	LOW SIGNAL RELAY	305
1-1617128-4 Waldom Electronics	JMSCD-26XP = M39016/16-036P	104
G6K 1172G Waldom Electronics	SMT RELAY	233
G6S 6018C Waldom Electronics	SMT RELAY	241
G6K 1148D Waldom Electronics	SURFACE MOUNT RELAY	2
1-1617164-6 Waldom Electronics	JMAPDD-5XL = M39016/20-037L	5
1-1617028-3 Waldom Electronics	HFW1101K00 = HFW 1/2 SIZE RELA	294
1-1617110-9 Waldom Electronics	JMGST-5MW = M28776/7-007M	15
G6S 6023M Waldom Electronics	SMT TAPE AND REEL RELAY	750
G6S 6170H Waldom Electronics	LOW SIGNAL RELAY	394
1-1617118-3 Waldom Electronics	J1MACD-12XLS = M39016/23-034L	5
G6S 6008F Waldom Electronics	SMT RELAY	10
G6J 6007D Waldom Electronics	LOW SIGNAL SMT RELAY	926
1-1617128-6 Waldom Electronics	JMSCD-5XLS = M39016/16-041L	5
G6E 1056M Waldom Electronics	LOW SIGNAL RELAY	484
G6S 6027B Waldom Electronics	SMT RELAY	878
G6K 1107G Waldom Electronics	SURFACE MOUNT RELAY	348
1-1617076-6 Waldom Electronics	3SBH1149A2 = M39016/14-007M	1
G5V 8000D Waldom Electronics	LOW SIGNAL RELAY	30
1-1617074-3 Waldom Electronics	3SBC5131K5 = RELAY	3

Signal Relays, Up to 2 Amps

1. Overview

Signal relays with ratings up to 2 amps are electromechanical or solid-state switching devices designed to control low-power electrical circuits. These components enable signal transmission isolation, circuit amplification, or switching automation in modern electronic systems. Their compact size and precise control capabilities make them essential in automation, telecommunications, and precision instrumentation systems.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Electromagnetic Relays	Mechanical switching via electromagnetic coil, standard form factor	Industrial control panels, HVAC systems
Solid-State Relays	No moving parts, zero-crossing switching, fast response	Temperature control systems, LED lighting
Reed Relays	Hermetically sealed contacts, high-speed operation	Telecom switching, test equipment
Time Delay Relays	Programmable switching intervals	Machinery automation, motor starters
High-Frequency Relays	Designed for RF/microwave signal paths	Wireless infrastructure, radar systems

3. Structure and Components

Typical construction includes:

Coil assembly (copper winding on bobbin)
Contact system (fixed and movable contacts)
Insulation housing (flame-retardant polymer)
Magnetic circuit (iron core and yoke)
Terminal system (PCB pins or screw terminals)

Advanced models incorporate EMI suppression circuits and LED status indicators.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Rated Current	1-2 A resistive	Determines load capacity
Coil Voltage	5-48 VDC nominal	Dictates control circuit design
Contact Resistance	<50 m	Impacts signal integrity
Insulation Resistance	>100 M	Safety isolation performance
Mechanical Life	10-100 million operations	Durability indicator
Switching Speed	5-15 ms (EMR), <1 ms (SSR)	System response time

5. Application Fields

Industrial automation (PLCs, sensor interfaces)
Telecom infrastructure (signal routing switches)
Medical equipment (diagnostic device controls)
Smart home systems (HVAC thermostats)
Test & measurement (ATE machine interfaces)

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Omron	G5LE-14-DC5	5 mm spacing, 2 A rating
Phoenix Contact	PSR-SCP-24UC	Plug-in design, LED indicators
TE Connectivity	RTX-S-DC5V	Automotive qualified
Siemens	3RT2025	Modular mounting system

7. Selection Recommendations

Key considerations:

Load type (resistive/inductive)
Environmental conditions (temperature/humidity)
Required make/break cycles
Regulatory certifications (UL/CSA/IEC)
PCB footprint constraints

Example: For medical equipment, select RoHS-compliant reed relays with 1.5 A rating and reinforced insulation.

8. Industry Trends

Current developments include:

Transition to surface-mount solid-state alternatives
Integration with IoT-enabled monitoring systems
Nanocoating for harsh environment protection
Increased adoption of 1 Form C contacts
Miniaturization (sub-10 mm package development)

Market forecasts predict 5.2% CAGR through 2027 driven by industrial automation growth.