Signal Relays, Up to 2 Amps

Part Number	Description / PDF	Quantity
1-1617164-8 Waldom Electronics	JMAPT-12XP = M28776/1-022P	2
1-1617164-1 Waldom Electronics	JMACT-5XP = M28776/1-025P	2
1-1617146-6 Waldom Electronics	JMGACD-5LW = M39016/18-037L	10
1-1617354-8 Waldom Electronics	3SAT1301A2=M5757/13-084	2
1393802-4 Waldom Electronics	V23030H1017A104	77
1-1393768-0 Waldom Electronics	R10-E6Z2-V700=R10	36
G6S 6003E Waldom Electronics	LOW SIGNAL RELAY	3686
G6AK1092M Waldom Electronics	LOW SIGNAL RELAY	14
G5V 8043H Waldom Electronics	LOW SIGNAL RELAY	102
G6A 1088C Waldom Electronics	LOW SIGNAL RELAY	420
G6S 6017E Waldom Electronics	SMT RELAY	50
1-1617121-9 Waldom Electronics	JMAC-5XP = M39016/9-057P	2
1-1617038-5 Waldom Electronics	HMB1131K01P = M39016/22-007P	33
G6E 1215E Waldom Electronics	LOW SIGNAL RELAY	892
G6K 1077A Waldom Electronics	LOW SIGNAL RELAY	5300
G6J 6025B Waldom Electronics	LOW SIGNAL LATCHING RELAY	32
G6S 6126M Waldom Electronics	LOW SIGNAL RELAY	170
G6AK1119F Waldom Electronics	LOW SIGNAL RELAY	147
G6S 6158R Waldom Electronics	LOW SIGNAL RELAY	1000
1-1617128-9 Waldom Electronics	JMSCD-5XP = M39016/16-033P	38

Signal Relays, Up to 2 Amps

1. Overview

Signal relays with ratings up to 2 amps are electromechanical or solid-state switching devices designed to control low-power electrical circuits. These components enable signal transmission isolation, circuit amplification, or switching automation in modern electronic systems. Their compact size and precise control capabilities make them essential in automation, telecommunications, and precision instrumentation systems.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Electromagnetic Relays	Mechanical switching via electromagnetic coil, standard form factor	Industrial control panels, HVAC systems
Solid-State Relays	No moving parts, zero-crossing switching, fast response	Temperature control systems, LED lighting
Reed Relays	Hermetically sealed contacts, high-speed operation	Telecom switching, test equipment
Time Delay Relays	Programmable switching intervals	Machinery automation, motor starters
High-Frequency Relays	Designed for RF/microwave signal paths	Wireless infrastructure, radar systems

3. Structure and Components

Typical construction includes:

Coil assembly (copper winding on bobbin)
Contact system (fixed and movable contacts)
Insulation housing (flame-retardant polymer)
Magnetic circuit (iron core and yoke)
Terminal system (PCB pins or screw terminals)

Advanced models incorporate EMI suppression circuits and LED status indicators.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Rated Current	1-2 A resistive	Determines load capacity
Coil Voltage	5-48 VDC nominal	Dictates control circuit design
Contact Resistance	<50 m	Impacts signal integrity
Insulation Resistance	>100 M	Safety isolation performance
Mechanical Life	10-100 million operations	Durability indicator
Switching Speed	5-15 ms (EMR), <1 ms (SSR)	System response time

5. Application Fields

Industrial automation (PLCs, sensor interfaces)
Telecom infrastructure (signal routing switches)
Medical equipment (diagnostic device controls)
Smart home systems (HVAC thermostats)
Test & measurement (ATE machine interfaces)

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Omron	G5LE-14-DC5	5 mm spacing, 2 A rating
Phoenix Contact	PSR-SCP-24UC	Plug-in design, LED indicators
TE Connectivity	RTX-S-DC5V	Automotive qualified
Siemens	3RT2025	Modular mounting system

7. Selection Recommendations

Key considerations:

Load type (resistive/inductive)
Environmental conditions (temperature/humidity)
Required make/break cycles
Regulatory certifications (UL/CSA/IEC)
PCB footprint constraints

Example: For medical equipment, select RoHS-compliant reed relays with 1.5 A rating and reinforced insulation.

8. Industry Trends

Current developments include:

Transition to surface-mount solid-state alternatives
Integration with IoT-enabled monitoring systems
Nanocoating for harsh environment protection
Increased adoption of 1 Form C contacts
Miniaturization (sub-10 mm package development)

Market forecasts predict 5.2% CAGR through 2027 driven by industrial automation growth.