Signal Relays, Up to 2 Amps

Image Part Number Description / PDF Quantity Rfq
G6J-2FL-Y DC12

G6J-2FL-Y DC12

Omron Electronics Components

RELAY TELECOM DPDT 1A 12VDC

1781

G6E-134P-ST-US-H-DC48

G6E-134P-ST-US-H-DC48

Omron Electronics Components

RELAY GEN PURPOSE SPDT 2A 48VDC

0

TXD2SS-4.5V-Z

TXD2SS-4.5V-Z

Panasonic

RELAY GEN PURPOSE DPDT 2A 4.5VDC

0

TQ2H-L2-9V

TQ2H-L2-9V

Panasonic

RELAY TELECOM DPDT 1A 9VDC

0

V23079G1003B301

V23079G1003B301

TE Connectivity Potter & Brumfield Relays

RELAY GEN PURPOSE DPDT 2A 12VDC

0

TXS2SA-24V-Z

TXS2SA-24V-Z

Panasonic

RELAY GEN PURPOSE DPDT 1A 24VDC

0

TX2SS-L-12V-Z

TX2SS-L-12V-Z

Panasonic

RELAY TELECOM DPDT 2A 12VDC

0

3SBC2017A2

3SBC2017A2

TE Connectivity Aerospace Defense and Marine

RELAY GEN PURPOS DPDT 2A 26.5VDC

0

TQ2SA-24V

TQ2SA-24V

Panasonic

RELAY TELECOM DPDT 2A 24VDC

0

1-1393808-6

1-1393808-6

TE Connectivity Potter & Brumfield Relays

RELAY GEN PURPOSE 4PDT 2A 72VDC

0

TXD2-2M-12V

TXD2-2M-12V

Panasonic

RELAY GEN PURPOSE DPDT 1A 12VDC

0

G6K-2P-Y DC24

G6K-2P-Y DC24

Omron Electronics Components

RELAY TELECOM DPDT 1A 24VDC

11297

2900342

2900342

Phoenix Contact

RELAY GP DPDT 50MA 120VAC/DC

0

V23101D1106B201

V23101D1106B201

TE Connectivity Potter & Brumfield Relays

RELAY GEN PURP SPDT 1.25A 12VDC

720

TXD2SA-L-3V-3-Z

TXD2SA-L-3V-3-Z

Panasonic

RELAY GEN PURPOSE DPDT 2A 3VDC

0

AZ822-2C-12DE

AZ822-2C-12DE

American Zettler

SUBMINIATURE DIP RELAY

389

R56-7D.5-12D

R56-7D.5-12D

NTE Electronics, Inc.

RELAY DPST-NO .5AMP 12VDC

4

R56S-5D.5-12

R56S-5D.5-12

NTE Electronics, Inc.

RELAY SPDT .5AMP 12VDC

259

G6SK-2G-H-TR DC3

G6SK-2G-H-TR DC3

Omron Electronics Components

RELAY TELECOM DPDT 2A 3VDC

0

EA2-12TNU

EA2-12TNU

KEMET

RELAY GEN PURPOSE DPDT 1A 12VDC

3576

Signal Relays, Up to 2 Amps

1. Overview

Signal relays with ratings up to 2 amps are electromechanical or solid-state switching devices designed to control low-power electrical circuits. These components enable signal transmission isolation, circuit amplification, or switching automation in modern electronic systems. Their compact size and precise control capabilities make them essential in automation, telecommunications, and precision instrumentation systems.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Electromagnetic RelaysMechanical switching via electromagnetic coil, standard form factorIndustrial control panels, HVAC systems
Solid-State RelaysNo moving parts, zero-crossing switching, fast responseTemperature control systems, LED lighting
Reed RelaysHermetically sealed contacts, high-speed operationTelecom switching, test equipment
Time Delay RelaysProgrammable switching intervalsMachinery automation, motor starters
High-Frequency RelaysDesigned for RF/microwave signal pathsWireless infrastructure, radar systems

3. Structure and Components

Typical construction includes:

  • Coil assembly (copper winding on bobbin)
  • Contact system (fixed and movable contacts)
  • Insulation housing (flame-retardant polymer)
  • Magnetic circuit (iron core and yoke)
  • Terminal system (PCB pins or screw terminals)

Advanced models incorporate EMI suppression circuits and LED status indicators.

4. Key Technical Parameters

ParameterTypical ValueImportance
Rated Current1-2 A resistiveDetermines load capacity
Coil Voltage5-48 VDC nominalDictates control circuit design
Contact Resistance<50 m Impacts signal integrity
Insulation Resistance>100 M Safety isolation performance
Mechanical Life10-100 million operationsDurability indicator
Switching Speed5-15 ms (EMR), <1 ms (SSR)System response time

5. Application Fields

  • Industrial automation (PLCs, sensor interfaces)
  • Telecom infrastructure (signal routing switches)
  • Medical equipment (diagnostic device controls)
  • Smart home systems (HVAC thermostats)
  • Test & measurement (ATE machine interfaces)

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
OmronG5LE-14-DC55 mm spacing, 2 A rating
Phoenix ContactPSR-SCP-24UCPlug-in design, LED indicators
TE ConnectivityRTX-S-DC5VAutomotive qualified
Siemens3RT2025Modular mounting system

7. Selection Recommendations

Key considerations:

  • Load type (resistive/inductive)
  • Environmental conditions (temperature/humidity)
  • Required make/break cycles
  • Regulatory certifications (UL/CSA/IEC)
  • PCB footprint constraints

Example: For medical equipment, select RoHS-compliant reed relays with 1.5 A rating and reinforced insulation.

8. Industry Trends

Current developments include:

  • Transition to surface-mount solid-state alternatives
  • Integration with IoT-enabled monitoring systems
  • Nanocoating for harsh environment protection
  • Increased adoption of 1 Form C contacts
  • Miniaturization (sub-10 mm package development)

Market forecasts predict 5.2% CAGR through 2027 driven by industrial automation growth.

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