DC DC Converters

Image Part Number Description / PDF Quantity Rfq
EPM78V2-03R3-01R0R

EPM78V2-03R3-01R0R

PowerStor (Eaton)

SWITCH REG DCDC CONV 1000MA 3.3V

179

EPM78V1-01R8-01R0R

EPM78V1-01R8-01R0R

PowerStor (Eaton)

SWITCH REG DCDC CONV 1000MA 1.8V

205

EPM12V1-05R5-01R0P

EPM12V1-05R5-01R0P

PowerStor (Eaton)

DCDC CONV 1000MA 0.9-5.5VDC

750

EPM78V2-15R0-01R0R

EPM78V2-15R0-01R0R

PowerStor (Eaton)

SWITCH REG DCDC CONV 1000MA 15V

204

EPM12V2-05R5-12R0N

EPM12V2-05R5-12R0N

PowerStor (Eaton)

DCDC CONV 12A 0.6-5.5VDC NEG LOG

950

EPM78V2-05R0-01R0R

EPM78V2-05R0-01R0R

PowerStor (Eaton)

SWITCH REG DCDC CONV 1000MA 5.0V

190

EPM12V2-05R5-12R0P

EPM12V2-05R5-12R0P

PowerStor (Eaton)

DCDC CONV 12A 0.6-5.5VDC POS LOG

100

EPM78V2-12R0-01R0R

EPM78V2-12R0-01R0R

PowerStor (Eaton)

SWITCH REG DCDC CONV 1000MA 12V

205

EPM78V2-06R5-01R0R

EPM78V2-06R5-01R0R

PowerStor (Eaton)

SWITCH REG DCDC CONV 1000MA 6.5V

191

DC DC Converters

1. Overview

Board Mount DC-DC Converters are electronic devices that convert direct current (DC) from one voltage level to another through switching technology. They enable voltage regulation and power distribution in embedded systems, providing galvanic isolation, voltage matching, and efficiency optimization. These converters are critical in modern electronics for enabling compact designs, improving energy efficiency, and ensuring stable power delivery in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Non-Isolated ConvertersShared ground reference, high efficiency (85-95%), low costPoint-of-load regulation in servers
Isolated ConvertersGalvanic isolation (1-6kV), reinforced safety, wide input rangeMedical equipment power supplies
Step-Down (Buck)Converts higher input to lower output voltage12V to 3.3V for microprocessors
Step-Up (Boost)Increases input voltage to higher output levels5V to 12V for display backlighting
BidirectionalSupports power flow in both directionsEnergy storage systems in EVs

3. Structure and Components

Typical construction includes:

  • Input EMI filter (common-mode choke + capacitors)
  • Power MOSFET/IGBT switching stage
  • Planar transformer (for isolation types)
  • PWM controller IC with feedback loop
  • Synchronous rectifier (for high-efficiency designs)
  • Output LC filter (inductor + ceramic capacitors)

4. Key Technical Specifications

ParameterImportance
Input Voltage RangeDetermines compatibility with power sources
Output Voltage AccuracyEnsures stable power for sensitive circuits
Efficiency (Typ. 80-97%)Impacts thermal performance and energy costs
Power Density (W/in )Key metric for space-constrained applications
Operating TemperatureDefines performance in harsh environments
Isolation VoltageSafety compliance for medical/industrial use

5. Application Fields

Major industries include:

  • Telecommunications (5G base stations, optical networking equipment)
  • Industrial Automation (PLCs, robotics controllers)
  • Medical Devices (patient monitoring systems, imaging equipment)
  • Consumer Electronics (gaming consoles, VR headsets)
  • Renewable Energy (solar inverters, energy storage systems)

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
TI (Texas Instruments)LM514565V input, 2.5A output, 95% efficiency
Monolithic PowerMPQ442045V input, 2A output, 3x3mm QFN package
VicorDCM311448V to 12V, 180W, 342W/in power density
CUI IncVX78-10001000V isolation, 10W output, medical grade

7. Selection Guidelines

Key factors to consider:

  • Input/output voltage requirements and transient response
  • Load current profile (continuous vs peak demands)
  • Thermal management capabilities
  • Form factor constraints (e.g., 1/16th brick standard)
  • Protection features (OVP, OCP, OTP)
  • Compliance certifications (CE, UL, IEC 60601-1)

8. Industry Trends

Current development directions include:

  • Adoption of GaN/SiC wide bandgap semiconductors for >97% efficiency
  • Digital control loops for dynamic voltage scaling
  • 3D packaging to achieve >500W/in power density
  • Integrated magnetics for reduced component count
  • Smart converters with PMBus interface for telemetry

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