ample-chip ample-chip
RFQ
BOM

Accessories

Image Part Number Description / PDF Quantity Rfq
7G0011A

7G0011A

TDK-Lambda, Inc.

HEATSINK W/THERM PAD .22"

7
DFN51120

DFN51120

TDK-Lambda, Inc.

RESISTOR THERMAL FUSE - PFE1000

1465
7G0026A

7G0026A

TDK-Lambda, Inc.

HEATSINK FOR PXF DC-DC CONVERTER

0
HAF15T

HAF15T

TDK-Lambda, Inc.

HEATSINK WIDTHWISE 1.5" FINS

656
IDQ48010A480V-002-R

IDQ48010A480V-002-R

TDK-Lambda, Inc.

MOD FILTER 75VDC 10A PCB MOUNT

69
HAQ10T

HAQ10T

TDK-Lambda, Inc.

HEATSINK FOR CNA30-100

181
HAF10L

HAF10L

TDK-Lambda, Inc.

HEATSINK FULL BRICK 1" FINS

349
HAMF10T

HAMF10T

TDK-Lambda, Inc.

HEATSINK PFE1000F

50
ARA00499

ARA00499

TDK-Lambda, Inc.

INPUT INDUCTOR FOR PFE300-700

704
HALF12T

HALF12T

TDK-Lambda, Inc.

HEATSINK PFE500F WIDTH 1.38" FIN

264
HAF15L

HAF15L

TDK-Lambda, Inc.

HEATSINK FULL BRICK 1.5" FINS

4162
7G0020A

7G0020A

TDK-Lambda, Inc.

HEATSINK W/THERM PAD .22"

0
HAH10T

HAH10T

TDK-Lambda, Inc.

HEATSINK

0
HAH15L

HAH15L

TDK-Lambda, Inc.

HEATSINK

0
7G0047C

7G0047C

TDK-Lambda, Inc.

HEATSINK FOR PXB DC-DC CONVERTER

0
7KTB025

7KTB025

TDK-Lambda, Inc.

TUBE FOR 10 PIECES PXD

0
HS00110

HS00110

TDK-Lambda, Inc.

HEATSINK, PFH500, 1.5" FINS

40
HAH10L

HAH10L

TDK-Lambda, Inc.

HEATSINK

0
ARA00539

ARA00539

TDK-Lambda, Inc.

INPUT INDUCTOR FOR PFE1000

0
PAH83L23

PAH83L23

TDK-Lambda, Inc.

HEATSINK THERMAL PAD KIT FOR DC/

0

Accessories

1. Overview

Board Mount Power Supply Accessories are components designed to facilitate the integration, protection, and optimization of power supply systems on printed circuit boards (PCBs). These accessories ensure reliable electrical connections, thermal management, and electromagnetic compatibility (EMC) in electronic devices. Their importance has grown with advancements in miniaturization, energy efficiency, and high-density computing systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Power ConnectorsHigh-current transmission, polarization protection, vibration resistanceServers, industrial automation equipment
Heat SinksPassive cooling, thermal conduction optimization, airflow compatibilityPower amplifiers, LED lighting systems
Fuse HoldersOvercurrent protection, quick-disconnect design, resettable optionsAutomotive electronics, consumer appliances
EMI FiltersHigh-frequency noise suppression, differential/common-mode filteringMedical imaging equipment, communication infrastructure
Terminal BlocksWire-to-board connectivity, screw/clamp termination, color codingIndustrial control panels, HVAC systems

3. Structure and Composition

Typical configurations include:

  • Power Connectors: Made of phosphor bronze contacts with gold plating, thermoplastic insulation (e.g., LCP), and polarization keys
  • Heat Sinks: Extruded aluminum fins with matte black anodization, mounting clips or thermal adhesive pads
  • EMI Filters: Pi-network configuration with X/Y capacitors and common-mode chokes in polymer housing
  • Fuse Holders: Ceramic body with spring-loaded brass contacts and transparent polycarbonate covers

4. Key Technical Specifications

ParameterDescriptionImportance
Current RatingMaximum continuous operating current (1-50A range)Determines power capacity and trace sizing
Dielectric StrengthWithstand voltage (500V-5kV AC)Ensures electrical safety and insulation reliability
Operating TemperatureFunctional range (-55 C to +150 C)Affects performance in harsh environments
Thermal Resistance C/W rating for heat dissipation efficiencyDirectly impacts component lifespan
Insertion LossSignal attenuation at specific frequencies (for EMI filters)Measures noise suppression effectiveness

5. Application Fields

  • Telecommunications: 5G base stations, optical network units
  • Consumer Electronics: Gaming consoles, high-end laptops
  • Medical Devices: MRI scanners, patient monitoring systems
  • Automotive: EV charging systems, ADAS controllers
  • Industrial: CNC machines, PLC systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityPower Triple Lock connectors3-point contact system, 14A rating
CUI DevicesAMM series heat sinksMulti-finned aluminum design, 20-40 C temperature reduction
LittelfusePOWR-GARD fuse holdersHigh-rupture capacity, LED fault indication
SchurterFMA12 EMI filter12mm slim profile, 250VAC rating

7. Selection Recommendations

Key considerations:

  1. Electrical parameters matching system requirements (voltage/current derating)
  2. Environmental factors (operating temperature, humidity, vibration)
  3. Compliance with standards (UL/CSA/IEC certifications)
  4. PCB footprint compatibility and assembly method (SMT vs. through-hole)
  5. Total Cost of Ownership (lifetime reliability vs. initial cost)

Example: Selecting a 40A connector with 20% derating for a 32A power rail in an industrial motor drive.

8. Industry Trends

Emerging developments include:

  • Integration of smart sensors for real-time thermal monitoring
  • Adoption of advanced materials like graphene-enhanced thermal pads
  • Miniaturization driven by high-density PCB designs (0.8mm pitch connectors)
  • Increase in 48V board-level power distribution systems
  • RoHS-compliant, halogen-free polymer formulations
RFQ BOM Call Skype Email
Top