Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	APA501-60-002 Emerson Embedded Power (Artesyn Embedded Technologies)	HEATSINK (60) 57.5X59X15MM HORZ	0
	EN1CN2 Vicor	ENMOD "C" 600W LPG THRD	0
	M-FIAM5BHK2 Vicor	FIAM5 "H" M28 20A XPG THRD ROH	0
	URAM3MS1 Vicor	URAM "M" 30A SPG SLOT	0
	FARM3CN2 Vicor	FARM3 "C" 500W LPG THRD	0
	M-FIAM9M12 Vicor	FIAM9 "M" M28 18A SP THRD	0
	FARM1EN1 Vicor	FARM1 "E" 500W LPG SLOT	0
	FIAM1H11 Vicor	FIAM "H" 48 10A SP SLOT	0
	URAM2M23 Vicor	URAM"M" 20A LP THRU	0
	M-FIAM3M22 Vicor	INPUT ATTENUATOR MODULE	0
	M-FIAM5BH23T Vicor	FIAM5 "H" M28 20A LP THRU TS	0
	VI-A11-MU Vicor	VI-A11-MU 24V 200W IAM	0
	FARM1T11 Vicor	FARM1 "T" 500W SP SLOT	0
	VI-AIM-I1-F4 Vicor	VI-AIM-I1-F4	0
	FIAM1CF1 Vicor	FIAM "C" 48 10A SPG SLOT ROHS	0
	M-FIAM3H21 Vicor	FIAM "H" M270 3A LP SLOT	0
	30195 Vicor	HS CFG "B" LONG .4H LOW FLOW T	0
	M-FIAM3MG1 Vicor	FIAM "M" M270 3A LPG SLOT ROHS	0
	EN1HN1 Vicor	ENMOD "H" 600W LPG SLOT	0
	VI-A11-CU-B1 Vicor	VI-A11-CU-B1	0

Accessories

1. Overview

Board Mount Power Supply Accessories are components designed to facilitate the integration, protection, and optimization of power supply systems on printed circuit boards (PCBs). These accessories ensure reliable electrical connections, thermal management, and electromagnetic compatibility (EMC) in electronic devices. Their importance has grown with advancements in miniaturization, energy efficiency, and high-density computing systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Power Connectors	High-current transmission, polarization protection, vibration resistance	Servers, industrial automation equipment
Heat Sinks	Passive cooling, thermal conduction optimization, airflow compatibility	Power amplifiers, LED lighting systems
Fuse Holders	Overcurrent protection, quick-disconnect design, resettable options	Automotive electronics, consumer appliances
EMI Filters	High-frequency noise suppression, differential/common-mode filtering	Medical imaging equipment, communication infrastructure
Terminal Blocks	Wire-to-board connectivity, screw/clamp termination, color coding	Industrial control panels, HVAC systems

3. Structure and Composition

Typical configurations include:

Power Connectors: Made of phosphor bronze contacts with gold plating, thermoplastic insulation (e.g., LCP), and polarization keys
Heat Sinks: Extruded aluminum fins with matte black anodization, mounting clips or thermal adhesive pads
EMI Filters: Pi-network configuration with X/Y capacitors and common-mode chokes in polymer housing
Fuse Holders: Ceramic body with spring-loaded brass contacts and transparent polycarbonate covers

4. Key Technical Specifications

Parameter	Description	Importance
Current Rating	Maximum continuous operating current (1-50A range)	Determines power capacity and trace sizing
Dielectric Strength	Withstand voltage (500V-5kV AC)	Ensures electrical safety and insulation reliability
Operating Temperature	Functional range (-55 C to +150 C)	Affects performance in harsh environments
Thermal Resistance	C/W rating for heat dissipation efficiency	Directly impacts component lifespan
Insertion Loss	Signal attenuation at specific frequencies (for EMI filters)	Measures noise suppression effectiveness

5. Application Fields

Telecommunications: 5G base stations, optical network units
Consumer Electronics: Gaming consoles, high-end laptops
Medical Devices: MRI scanners, patient monitoring systems
Automotive: EV charging systems, ADAS controllers
Industrial: CNC machines, PLC systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	Power Triple Lock connectors	3-point contact system, 14A rating
CUI Devices	AMM series heat sinks	Multi-finned aluminum design, 20-40 C temperature reduction
Littelfuse	POWR-GARD fuse holders	High-rupture capacity, LED fault indication
Schurter	FMA12 EMI filter	12mm slim profile, 250VAC rating

7. Selection Recommendations

Key considerations:

Electrical parameters matching system requirements (voltage/current derating)
Environmental factors (operating temperature, humidity, vibration)
Compliance with standards (UL/CSA/IEC certifications)
PCB footprint compatibility and assembly method (SMT vs. through-hole)
Total Cost of Ownership (lifetime reliability vs. initial cost)

Example: Selecting a 40A connector with 20% derating for a 32A power rail in an industrial motor drive.

8. Industry Trends

Emerging developments include:

Integration of smart sensors for real-time thermal monitoring
Adoption of advanced materials like graphene-enhanced thermal pads
Miniaturization driven by high-density PCB designs (0.8mm pitch connectors)
Increase in 48V board-level power distribution systems
RoHS-compliant, halogen-free polymer formulations