LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5530201400F

5530201400F

Dialight

LED CBI 3MM BI-LVL BLANK/RED

0

5502407100F

5502407100F

Dialight

LED CBI 5MM RED DIFF 20MA

0

5680102102F

5680102102F

Dialight

LED CBI 3MM 4X1 GRN,RED,X,GRN

0

5922628313F

5922628313F

Dialight

LED CBI PRISM BLVL BLU/WH TR SIL

0

5640140303F

5640140303F

Dialight

LED CBI 3MM 3X1 YELLOW/X/YELLOW

0

5700100323F

5700100323F

Dialight

LED CBI 2MM 3X1 YLW,GRN,YLW DIFF

0

5640200804F

5640200804F

Dialight

LED CBI 3MM 3X1 GRN/YLW/YLW

0

5600508F

5600508F

Dialight

LED CBI BI-LEVEL T/H

0

5520912801F

5520912801F

Dialight

LED 5MM BI-LEVEL CBI R,G

0

5640100217F

5640100217F

Dialight

LED CBI 3MM 3X1 GRN/RED/ORN DIFF

0

5500705003F

5500705003F

Dialight

LED CBI 5MM GREEN 5V TRI

0

5530111010F

5530111010F

Dialight

LED CBI 3MM BI-LVL RED/RED

0

5505205003F

5505205003F

Dialight

LED CBI 5MM GRN DIFF TRI BLK

0

5511309801F

5511309801F

Dialight

LED CBI 3MM GREEN LOW CURRENT

0

HLMP1700106F

HLMP1700106F

Dialight

LED CBI 3MM ARRAY 1X6 RED 2MA TH

0

5522211100F

5522211100F

Dialight

LED CBI 5MM BI-LEVEL BKLT RD/RD

0

5511307010F

5511307010F

Dialight

LED CBI 3MM GREEN LOW CURR .200

0

5640001803F

5640001803F

Dialight

LED CBI 3MM TRI-LEVEL ARRAY

0

5600501F

5600501F

Dialight

LED CBI BI-LEVEL T/H

0

5510807010F

5510807010F

Dialight

LED 3MM CBI BLUE DIFF REVPOL

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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