LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5510001881F

5510001881F

Dialight

LED CBI 3MM YELLOW SGL BLOCK RA

0

5500001853F

5500001853F

Dialight

LED CBI 5MM 1LEVEL

0

5510307100F

5510307100F

Dialight

LED CBI 3MM YELLOW DIFF RA .200

0

5530177005F

5530177005F

Dialight

LED CBI 3MM BI-LVL ORN/ORN DIFF

0

5530113802F

5530113802F

Dialight

LED CBI 3MM BI-LVL RED/YELLOW

0

5511111F

5511111F

Dialight

LED CBI 3MM RED LOW CURR .200

0

5530008812F

5530008812F

Dialight

LED CBI 3MM R,Y,R,Y,X,X,X,X RA

0

5503107004F

5503107004F

Dialight

LED CBI 5MM YLW/GRN QUAD BLOCK

0

5680100222F

5680100222F

Dialight

3MM QUAD LEVEL CBI X-G-G-G

0

5502207100F

5502207100F

Dialight

LED CBI 5MM GREEN DIFFUSED RA

0

5530213400F

5530213400F

Dialight

LED CBI 3MM BI-LVL RED/YLW DIFF

2200

5690714804F

5690714804F

Dialight

LED CBI 3MM BI-LEVEL Y/G,BLUE

0

5530002842F

5530002842F

Dialight

LED CBI 3MM YW/RD DIFF BI-LVL RA

0

5680701414F

5680701414F

Dialight

LED CBI 3MM 4X1 R/G,Y/G,R/G,Y/G

0

5532223110F

5532223110F

Dialight

LED CBI 3MM BI-LVL GRN/YLW TINT

0

5680101237F

5680101237F

Dialight

LED CBI 3MM 4X1 RED,GRN,YLW,ORN

0

5690101970F

5690101970F

Dialight

LED CBI 3MM BI-LEVEL R,B,O,X

0

5512507004F

5512507004F

Dialight

LED 3MM QUAD HI EFF ORN PC MNT

0

5680103022F

5680103022F

Dialight

LED 3MM QUAD LEVEL CBI

0

HLMP1700104F

HLMP1700104F

Dialight

LED CBI 3MM ARRAY 1X4 RED 2MA TH

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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