LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5962420002F

5962420002F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5690794807F

5690794807F

Dialight

LED 3MM BI-LEVEL CBI

0

5553008F

5553008F

Dialight

LED 2MM 24V VERTICAL RED PC MNT

2545

5530232300F

5530232300F

Dialight

LED CBI 3MM BI-LVL YLW/GRN DIFF

0

5612301080F

5612301080F

Dialight

LED 5MM VERT HE DIFF YLW PC MNT

0

5530004811F

5530004811F

Dialight

3MM BI-LEV X 2 CBI G,G,G,Y/G

0

5913501852F

5913501852F

Dialight

3MM SQ PRISM R,G,B 13 REEL

0

5000035F

5000035F

Dialight

KIT PROMO PRISM 12/11

18

5530006813F

5530006813F

Dialight

LED CBI 3MM RD/RD/RD/GN/GN/RD RA

0

5530199F

5530199F

Dialight

LED CBI 3MM BI-LVL WHITE/WHITE

45

5610008801F

5610008801F

Dialight

SMD PRISM ARRAY PCB ASSEMBLY

0

5511307805F

5511307805F

Dialight

LED CBI 3MM GREEN DIFF RA .200

0

5530111003F

5530111003F

Dialight

LED CBI 3MM BI-LVL RED/RED

0

5640740114F

5640740114F

Dialight

LED CBI 3MM 3X1 R/G,R/G,Y/G

0

5530008809F

5530008809F

Dialight

LED CBI 3MM GREENX4, G/Y X4

0

5530222003F

5530222003F

Dialight

LED CBI 3MM BI-LVL GRN/GRN DIFF

0

5600308F

5600308F

Dialight

LED CBI BI-LEVEL T/H

0

5510207815F

5510207815F

Dialight

LED CBI 3MM HI EFF GREEN .200

0

5530210200F

5530210200F

Dialight

LED CBI 3MM BI-LVL RED/BLANK

0

5700100033F

5700100033F

Dialight

LED CBI 2MM 3X1 X,YLW,YLW DIFF

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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