LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5710132100F

5710132100F

Dialight

LED CBI 2MM BI-LEVEL YW,GN DIFF

1051

5912001007F

5912001007F

Dialight

LED PRISM 3MM RND HI EFF RED SMD

0

5530121300F

5530121300F

Dialight

LED CBI 3MM BI-LVL GREEN/RED

0

5510801F

5510801F

Dialight

LED CBI 3MM DIN BLUE DIFF RA SGL

1

5922626313F

5922626313F

Dialight

LED CBI PRISM BLVL BLUBLU TR SIL

0

5952401013NF

5952401013NF

Dialight

2MM PRISM Y 13 REEL

0

5912301013F

5912301013F

Dialight

LED PRISM 3MM RT ANG GREEN SMT

4350

5680102311F

5680102311F

Dialight

LED CBI 3MM 4X1 GRN,YLW,RED,RED

0

5921410302F

5921410302F

Dialight

LED PRISM 3MM BI-COLOR SMD

0

5710133810F

5710133810F

Dialight

LED CBI 2MM BI-LEVEL X 2 Y,Y

0

5912101013F

5912101013F

Dialight

LED PRISM 3MM RA ALGAAS RED SMT

5707

5501207F

5501207F

Dialight

LED 5MM RT ANG LOW CUR YEL PCMNT

0

5913001007F

5913001007F

Dialight

LED PRISM 3MM RA SUP RED/GRN SMT

3073

5922631313F

5922631313F

Dialight

LED CBI PRISM BLVL BLU/YG TR SIL

0

5503010F

5503010F

Dialight

LED CBI 5MM RED/GRN BICOLOR

0

5913601102F

5913601102F

Dialight

LED PRISM 3MM BI-COLOR SMD

0

5912701847F

5912701847F

Dialight

LED SMD PRISM 3MM 590NM YLW

0

5530211200F

5530211200F

Dialight

LED CBI 3MM BI-LVL RED/RED DIFF

54

5962926013F

5962926013F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5710123F

5710123F

Dialight

LED CBI 2MM BI-LEVEL GN,YW DIFF

1897

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

RFQ BOM Call Skype Email
Top