LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5530201200F

5530201200F

Dialight

LED CBI 3MM BI-LVL BLANK/RED

0

DC10CGKWA

DC10CGKWA

Kingbright

LED BAR GRAPH 10SEG 570NM GRN

1757

XPZ3LUY11D

XPZ3LUY11D

SunLED

LED 3POS YELLOW DIFFUSED CBI

0

SSA-LXH1025ID

SSA-LXH1025ID

Lumex, Inc.

LED ARRAY 2.5X5MM 10-SEG RED

1147

SSB-LX2635IW

SSB-LX2635IW

Lumex, Inc.

LED LTBAR 2WINDOW 8CHIP RED DIFF

85

5700100322F

5700100322F

Dialight

LED CBI 2MM 3X1 YLW,GRN,GRN DIFF

0

5680731111F

5680731111F

Dialight

LED 4HIGH GRN/RED BICLR 3MM

0

5530008813F

5530008813F

Dialight

LED CBI 3MM R,Y,R,Y,R,Y,R,Y RA

0

HLMP-6500-F0010

HLMP-6500-F0010

Broadcom

LED DOME 565NM GRN DIFF RA AXIAL

6951

XPF2LUY11D

XPF2LUY11D

SunLED

LED IND 3MM YW DIFF BI-LEVEL CBI

0

5510409808F

5510409808F

Dialight

LED 3MM CBI R/A R RV POL.125

0

5513011F

5513011F

Dialight

LED CBI 3MM RED/GRN BICOLOR RA

0

XVH2LUY50D

XVH2LUY50D

SunLED

LED 5MM YELLOW DIFF BI-LEVEL CBI

0

SSF-LXH22573IID

SSF-LXH22573IID

Lumex, Inc.

LED 2X5MM RA 2-HI RED/RED PCMNT

372

5640700101F

5640700101F

Dialight

LED CBI 3MM 3X1 R/G,BLANK,R/G

11

HLMP-2755

HLMP-2755

Broadcom

LED LT BAR 8.89X8.89MM SGL YLW

3135

NTE3111

NTE3111

NTE Electronics, Inc.

5-LED RED BAR

182

5341H1

5341H1

Visual Communications Company, LLC

LED RED T1-3/4 VERTICAL PCB

1526

5530107F

5530107F

Dialight

LED CBI 3MM BI-LVL BLANK/ORANGE

0

5952602007SF

5952602007SF

Dialight

LED PRISM 2MM SQ INGAN BLUE SMD

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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